Electronics Protection - November/December 2012 - (Page 22)

EMI/EMC/ESD Leader Tech Receives MIL-SPEC Certification on All 12 Conductive Elastomer Compounds Leader Tech’s expanded line of TechSIL Conductive Elastomer compounds has received QPL certification by the Defense Logistics Agency. This certification commitment distinguishes Leader Tech as the only MIL-SPEC approved and certified manufacturer of all 12 conductive elastomer formulations. This certification authorizes the company to formulate, extrude and mold conductive elastomers to MIL-DTL-83528D specifications. Leader Tech’s TechSIL gaskets are manufactured at its recently expanded Global EMI Shielding Technology Center using proprietary base formulations of silicone, fluorosilicone and EPDM rubber that are embedded with highly conductive fillers including: silver, silver/copper, silver/aluminum, silver/nickel, silver/glass and nickel coated graphite. The company offers numerous standard gasket profiles as well as unlimited variations of extruded, molded, sheet stoc and die-cut finishes. Leader Tech’s TechSIL 5000 conductive elastomers provide engineers with a customizable gasketing solution that delivers a shielding effectiveness of up to 110 dB across wide temperature variations and environmental conditions. An onsite applications engineer is also available to help formulate materials to meet custom requirements. ignates surfaces where UTD creeping wave calculations may be applied. Visualization of the edges and smooth surfaces will give users a better understanding of how their geometry will be used in the calculations. SP1008 Series TVS Diode Arrays Absorb Repetitive ESD Strikes in a 0201 Footprint Remcom Makes Major Update to XGtd Electromagnetic Analysis Software Remcom has made an update to XGtd, a tool for analyzing far zone radiation, RCS and EMI/EMC for electrically large platforms. The Release 2.6 includes functionality for radar cross section (RCS) applications including a more accurate hybrid model based on Physical Optics (PO) and the Method of Equivalent Currents (MEC), output types for far zone RCS and antenna gain field points, ray path visualization to far zone field points and visualization of edges considered by the calculation to be part of curved surfaces. The hybrid model is based on the Method of Equivalent Currents (MEC) and Physical Optics (PO), resulting in improved accuracy in all scattering directions that can be applied to RCS calculations for electric conductors or dielectric surfaces. New far zone outputs include scattering amplitude and excess time of arrival for ray paths. Additionally, electric field magnitude and phase, complex impulse response and Poynting vector magnitude, which were previously restricted to near zone locations, can now be calculated at a user-specified distance from the transmitter. Ray paths for far zone antenna gain and RCS calculations can now be displayed in the graphical user interface. Rays will be colored according to strength, allowing users to identify strong scattering features on the project geometry. Adjacent geometry faces within a specified angle range will be treated as a smooth curved surface during calculations. For far-zone RCS calculations, this impacts which models will be used (physical optics or MEC), and for antenna radiation it des22 Littelfuse, Inc. has developed a line of transient voltage suppression (TVS) diodes for general purpose ESD protection applications. SP1008 series TVS Diode Arrays (SPA) are capable of protecting chipsets up to ±15 kV with a low dynamic resistance of 1.3 ohms, providing clamping performance in a very space efficient footprint. These diodes can safely absorb repetitive ESD strikes (±15 kV contact discharge) without performance degradation above the maximum level specified in the IEC61000-4-2 international standard. The back-to-back configuration of the SP1008 series provides symmetrical ESD protection for data lines and can be used when AC signals are present. They are well suited for use in applications where board space is at a premium, such as smartphones, mobile phones, tablet devices, portable navigation devices, digital cameras, and portable medical devices. The SP1008 series TVS diode arrays (SPA) offer manufacturers and designers of mobile or consumer electronic a variety of key benefits including a clamping performance of 10.7 V due to their low dynamic resistance of 1.3 Ω. Their efficient design footprint saves valuable board space and allows for greater layout flexibility and their low leakage current (0.1 μA max at 5 V) minimizes drain and increases battery life in battery-powered applications. Lapp’s Cable Glands Deliver EMI Protection with Simplified Installation Lapp Group’s SkinTop MS-M Brush is now available in NPT sizes from ¾ inch to 2 inches. Previously only available in metric sizes, Lapp’s cable gland enables engineers to address EMI control on the factory floor more effectively than other termination methods, such as the grounding clamps commonly used on drive systems. The SkinTop MS-M Brush provides continuous 360° contact around the cable’s screen braid, which protects against EMI by lowering the resistance of current ground path and providing a low impedance connection between the cable shield and the housing. Some shielding options have difficult termination methods or grounding connections that can drive up labor cost and time. Lapp’s design addresses this common installation issue by making it easier for engineers and plant managers to create an EMI-free connection between the cable and the SkinTop cable gland. Installers simply insert the cable, push the screen braid into the brush and tighten the cable gland assembly. Other grounding methods such as earthing sleeves require far more effort to make the termination. December/November 2012 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - November/December 2012

Electronics Protection - November/December 2012
Buckeye Shapeform Provides Nuclear Lab New Case Options
Collaborative Design of Custom Enclosures - An Overview of the Process
Lowering Data Center Energy Bills: DCIM to the Rescue
What the New NFPA Workplace Electrical Safety Provisions Mean for Data Center Managers
Mitigating Risks Through Power Distribution Design
Don’t Call it a Box! Instrument Cases Can Combine Strength and Eye Appeal
L-com Adds New Sizes to Its Non-Powered Weatherproof Industrial Enclosures Line
Nusil Presents Thermally Conductive Electronic Packaging Material
Lapp’s Cable Glands Deliver EMI Protection and Simple Installation
New Surge Suppression Solution to Shield Electronics from Surge Energy Let-Through
Chatsworth Products Increases Surface Area on Cable Pathways by 400 Percent
Industry News
Calendar of Events

Electronics Protection - November/December 2012