Electronics Protection - May/June 2013 - (Page 26)

Hardware Dirak Introduces a New Swinghandle Dirak’s new low-profile design Swinghandle is designed for applications requiring limited protrusion off the panel face enhancing the aesthetics of overall cabinet design The 2-085SL Swinghandle includes a stop feature at 90° to prevent overrotation of the cam. It can be used for both left and right hand applications by reversing the cam adapter and the cam. The 2-085SL can also be used with all standard 1, 2, or 3-pt cams/adapters. The 2-085SL Swinghandle comes with a shutter on the lock cylinder that prevents dust and debris from entering and damaging the lock. The standard Swinghandle comes with the Dirak 1333 key, but can be keyed different/mixed upon request. These Swinghandles are pre-assembled and incorporate Diraks’s D-Snap Technology for quick installation without tools or mounting hardware. In this product, the D-Snap Technology mechanism is only at the top of the 2-085SL Swinghandle. The bottom is inserted through the panel cut-out and incorporates a hook feature for mounting in place of the snap element. The D-Snap Technology eliminates the concern of mounting hardware becoming loose over time, and withstands vibration and heavy loads. D-Snap is designed for easy disassembly for maintenance or repair. Products can be removed from the panel with a tool from inside the enclosure. This makes the unit well suited for sheet metal door applications for telecom or industrial enclosures that require a locking mechanism. Low Resistance Gold Plated Connector Released Fujipoly’s Zebra Gold series 8000B is a low resistance connector that is capable of transferring both data and power between parallel components or circuit boards. This interconnect device is constructed from a low durometer silicone core that is covered with 133 parallel rows of flat, gold-plated wires per inch. This construction allows the connector to accommodate PCBs with pad center spacing down to 0.19 mm. In addition, each 0.0 5mm by 0.10 mm gold-plated element delivers a current carrying capacity of 500 mA while exhibiting a typical electrical resistance of less than 25 milliohms on a 0.635 mm wide contact pad. Many of today’s advanced portable electronic devices require specialized connectors to make electrical contact between the printed circuit board and intricate user interfaces such as LCD and touch screen displays. Fujipoly’s Zebra Gold series 8000B is designed for these products as well as for any board to board electronic packaging applications with tight pad spacing and board separation tolerances. FCI’s RotaConnect Board-to-Board Connector Can Be Adjusted to Almost Any Angle FCI has developed a hermaphroditic board-to-board connector that can be rotated to any angle between 90° and -60°. The RotaConnect rotatable board to board connector offers design flexibility as the same connector is capable of providing perpendicular, co-planar, or angled interconnect solutions. The hermaphroditic board-to-board connector, which mates to itself can also be placed anywhere on the PCB, further expanding design options. The RotaConnect connector features a dual beam spring 26 contact design, delivering performance and reliability. Designed with a passive latch for housing retention, the rotatable board-to-board connector’s housing protects the pins and prevents mis-mating. Available with optional side brackets for increased PCB retention and optional pegs for location, the connector supports multiple mating and un-mating directions with Y and Z directional floating allowance. Featuring a 3.00 mm pitch, these high board-to-board connectors are available in positions ranging from two up to 14 (increments of two). RotaConnect is rated up to 5 A with an operating voltage of 125 VAC and a temperature range of -40°C up to 125°C. TE Connectivity Releases Universal Connectivity Platform TE Connectivity has introduced a new addition to its range of infrastructure management solutions for the data center or LAN environment. The universal connectivity platform (UCP) is a modular cabling concept designed for speed and flexibility, facilitating data center migration from 1 to 100 GbE. Supporting both copper and fiber component cabling, TE’s UCP delivers added rack efficiency and is well suited for rapidly changing network communications infrastructure environments where space is at a premium. The UCP concept includes a range of TE components including: patch panels, subfloor panel and overhead panel mounts, pre-terminated links and adaptor modules. One common patch panel is used to accommodate both copper and fiber and can be installed within or outside the 19-inch envelope. Side-mounting brackets maximize usable space along the vertical posts of the rack system, while adaptive mounting brackets can be used strategically above and below the racks. PEM Heat Sink Mounting System Provides Secure Attachment and Heat Dissipation The PEM heat sink mounting system introduces an engineered solution to securely attach heat sinks to circuit boards, while providing firm and constant contact to the chip component for optimum heat dissipation. The system additionally integrates an audible “click” feature to prevent over tightening during installation, accommodates slight expansion and contraction of joint components without causing stress or damage, and allows for removal of the heat sink if necessary. This three-piece fastening system (individual parts supplied separately) consists of Type HSCB captivating screw and Type HSL spring mated to Type HSR broaching receptacle nut or standoff. The screw and spring mount together permanently into the heat sink and the receptacle nut/standoff mounts permanently to the PC board. After the screw and spring are captivated during the installation process, the heat sink can be attached easily to the board by tightening the screw into the receptacle nut/standoff. The audible May/June 2013 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - May/June 2013

Electronics Protection - May/June 2013
Newer Technology Releases Next-Generation Power2U AC/USB In Wall Charging Solution
Raritan Boosts its DCIM Leadership Position with dcTrack 3.0
Specifiers of Enclosures for Components in Outdoor Applications: Be Aware of Material Selection Issues
Realizing the Many Benefits of Power System Relay Upgrades
How to Protect Electronic Circuits from Power Surges
A Little Diamond Goes a Long Way: Overcoming Thermal Limitations to Enable Next Generation Technology
Hardware Technology Eliminates Problems Caused by Using Traditional Captive Screws
Managing Lithium-Chemistry Batteries: It’s Mostly About Their Temperature
Protecting and Improving Electronic Components Performance
Advancements in Thermal Management Conference Preview
One Stop Systems Introduces nanoCUBE Desktop Expansion
Select-A-Shield RF Shielded Tent Closure System Is Non-Radiating
Thermoelectric Air Conditioner Delivers Maximum Cooling Regardless of Power Supply
On-line, Double-Conversion UPS from Emerson Network Power Earns Energy Star Qualification
Dirak Introduces a New Swinghandle
Dual-Cure Conformal Coating Eliminates Need for Additional Processing
Industry News
Calendar of Events

Electronics Protection - May/June 2013