Electronics Protection - May/June 2013 - (Page 28)
Contamination
Chemtronics Introduces Flexible Conformal
Coating Konform Flexcoat
Chemtronics has releases the Konform Flexcoat conformal coating, which
is designed for applications where flexibility and protection are paramount.
It is as flexible as an RTV silicone, but
without the disadvantages of silicone.
Providing a soft, rubbery protective
coating, Konform Flexcoat will coat
evenly and provide a flexible and durable protective barrier against humidity, salt, corrosive vapors and fungus. It
is well suited for both flexible and rigid printed circuit boards and
electronic assemblies. Cured coating can easily be removed by cutting a small section and peeling the coating away from the surface,
or by solvent immersion of the whole board.
Konform Flexcoat meets IPC-CC-830B Class B. It contains a
UV indicator for quality control inspection. It is compliant with
European RoHS and REACH directives in addition to most other
environmental standards. Konform Conformal Coatings are used
to protect printed circuit boards, components and flex circuitry.
These coatings provide excellent electrical insulation and withstand hot and cold operating environments, as well as heat generated by electronic circuitry.
Epoxies, Etc. Releases 60-7170 Potting and
Encapsulating Systems
Epoxies, Etc. is offering a solution
for the problems many potting and
encapsulating applications face. The
60-7170 has many advantages over
standard two-component systems and
even other UV cures.
First, because the 60-7170 is a
one-component material, the need for
mixing and measuring is eliminated
and no waste is created by unused mixed product. In addition,
there are no limits to working time, yet cure time is shortened
greatly. These two factors make 60-7170 a good choice for high
volume production.
The 60-7170 is specially formulated to cure quickly in sections
up to ¾ inch and also in shadowed areas such as underneath
components with no additional heat. Excellent adhesion and low
shrinkage make it useful for other applications as well. Rapid, tackfree cures can be achieved with the use of a simple black light.
New Dimensionally Stable UV Curable System
With a High Glass Transition Temperature
Suitable for high production applications,
Master Bond’s UV25 offers fast fixture times,
rapid curing and high temperature resistance.
This multifunctional one component UV curable system was developed for bonding, sealing, coating and encapsulation applications.
Master Bond UV25’s most notable feature
is its thermal stability, with a glass transition
temperature of 186°C. It is serviceable over a
range of -60°F to 500°F. Additionally, this material is optically clear with a refractive index
of 1.55 at room temperature.
Upon exposure to a UV light source emitting at a wavelength
28
of 320 to 365 nm, with an energy output of 20 to 40 milliwatts
per cm², UV25 cures in 20 to 30 seconds. The rate of cure also
depends upon the compound’s distance from the light source, the
thickness of the section and the intensity of the light source. It is
not oxygen inhibited and therefore does not require any special
treatment in that regard. The product does not contain any solvents or volatiles and features low shrinkage upon curing. It bonds
well to glass, surface treated metals and plastics such as polycarbonates and acrylics, among others.
When being used in potting applications, this system can cure
in section up to 0.100 to 0.120 inches. At room temperature, UV25
has a moderate viscosity of 7,000 to 11,000 cps. It is also a competent electrical insulator.
Polyonics Expands its PolyFLEX Flexible
Substrate Line
Polyonics has expanded its line of PolyFLEX flexible substrates. The PolyFLEX line
has added new sizes, functions and performances including ultra-thin (13 µm) amber
and high opacity black polyimide films.
In addition, a variety of white, clear and
matte black top coats are available including a new harder and more durable white
top coat that is aimed at high temperature
laminations, as well as antistatic and flame
retardant functionalities.
The substrates provide the physical and
electrical properties needed for flexible circuits. They are designed
using polymer coating technologies developed for the extreme
temperatures and harsh environments found in PCB manufacturing. The coatings allow printing with conductive, semi-conductive
and resistive inks via Flexo and Screen printing. Along with printability, these constructions can provide thermal management,
electrical isolation, electrostatic dissipation to help prevent ESD in
static sensitive devices (SSD) and fire retardant options.
Dual-Cure Conformal Coating Eliminates Need
For Additional Processing
Dymax Corp. has introduced
Dual-Cure 9482, a light- and
moisture-cure conformal coating specially formulated to cure
in shadowed areas underneath
components on printed circuit
boards. The product’s ability to
cure in shadowed areas over time
with ambient moisture results in
faster throughput for thru-hole
assemblies. The 9482 was developed to be tack free immediately
after curing, helping to avoid defects such as fingerprints that may
be left on the boards if they are handled too soon. It’s engineered
for coating thicknesses up to 0.254 mm (0.010 inches) and offers
added protection for electronics.
Dymax 9482 demonstrates re-workability, which is of particular
importance to manufacturers of expensive PCBs or customers
looking to increase board yields. Fluorescing a vivid blue when
exposed to UV light, 9482 provides obvious detection of coating
presence before and after cure.
May/June 2013
www.ElectronicsProtectionMagazine.com
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Table of Contents for the Digital Edition of Electronics Protection - May/June 2013
Electronics Protection - May/June 2013
Newer Technology Releases Next-Generation Power2U AC/USB In Wall Charging Solution
Raritan Boosts its DCIM Leadership Position with dcTrack 3.0
Specifiers of Enclosures for Components in Outdoor Applications: Be Aware of Material Selection Issues
Realizing the Many Benefits of Power System Relay Upgrades
How to Protect Electronic Circuits from Power Surges
A Little Diamond Goes a Long Way: Overcoming Thermal Limitations to Enable Next Generation Technology
Hardware Technology Eliminates Problems Caused by Using Traditional Captive Screws
Managing Lithium-Chemistry Batteries: It’s Mostly About Their Temperature
Protecting and Improving Electronic Components Performance
Advancements in Thermal Management Conference Preview
One Stop Systems Introduces nanoCUBE Desktop Expansion
Select-A-Shield RF Shielded Tent Closure System Is Non-Radiating
Thermoelectric Air Conditioner Delivers Maximum Cooling Regardless of Power Supply
On-line, Double-Conversion UPS from Emerson Network Power Earns Energy Star Qualification
Dirak Introduces a New Swinghandle
Dual-Cure Conformal Coating Eliminates Need for Additional Processing
Industry News
Calendar of Events
Electronics Protection - May/June 2013
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