Electronics Protection - May/June 2013 - (Page 29)

Calendar Thermacore Provides Mission-Critical Performance for Landsat Imaging Satellite When NASA’s latest earth-observation satellite, the Landsat Data Continuity (LDCM) mission launched into orbit, it carried some of the world’s most advanced space technology, including mission-critical cooling components from k Technology, a Division of Thermacore, Inc. Once thoroughly tested in orbit, the satellite will be known as Landsat 8 and will be operated by the US Geological Survey. Landsat 8 is intended to monitor environmental, natural and man-made changes to the Earth’s surface using two sensitive datacollecting instruments, the Operational Land Imager (OLI) and the Thermal Infrared Sensor (TIRS). Thermal management, to preserve the accuracy and life of these high-tech devices, is crucial to the success of the mission, which is expected to last several years. Throughout the Landsat 8 mission, internal heat generated by the satellite’s electronics must continually be rejected to the cold and vacuum of outer space, with maintenance and adjustments being impossible after launch. To meet this thermal challenge, while maintaining a strict launch schedule, NASA called upon Thermacore’s thermal management technologies to create three thermal solutions designed to help the TIRS instrument operate at peak efficiency. One of the three solutions is a thermal spreader constructed from k-Core Annealed Pyrolytic Graphite (APG) encapsulated within aluminum. The thermal spreader will dissipate heat quickly, and reduces high temperatures and variations in temperature, while keeping the delicate TIRS instrumentation significantly cooler than a traditional aluminum-based thermal design. The TIRS components will also be protected by two additional Thermacore solutions that supply both thermal management and structural support. The first is a thermal bracket that conducts the heat from the approximately 185°K telescope to its radiator. The second is a large cryocooler supporting bracket providing high Calendar of Events heat conductance and strong support to ensure consistent thermal performance throughout the mission. In creating this component, Thermacore engineers fashioned a lightweight, high-integrity 20-pound bracket from 400 pounds of encapsulated APG. DIN Rail Industrial PC Market to Grow Quickly In 2013 The DIN rail industrial PC (IPC) market is projected the fastest growth of all industrial PC types in 2013, according to a published report by IMS Research. “DIN rail IPCs are not new in the IPC market, but several trends have coincided to seed growth for the future,” said IHS senior analyst for IPCs Toby Colquhoun. “First, control engineers have increasing confidence in PC-based technology for critical tasks, whereas in the past using a programmable logic controller (PLC) was the only acceptable solution. Second, most manufacturing organizations continue to connect factory and enterprise networks. As enterprise networks are typically PC-based, DIN rail IPCs allow seamless integration between decision makers and the factory floor.” DIN rail IPC suppliers have reacted appropriately to customer requirements, and have begun to offer next generation products. In 2011, Advantech and Beckhoff were estimated to account for most revenues. IHS projects the future market structure will differ as new DIN rail IPC suppliers (such as Siemens, IEI, and Nexcom) offer new products and reach new customers. Beyond traditional industrial automation applications, DIN rail IPC adoption continues to grow in transportation and building automation. IHS projects a revenue compound annual growth rate (CAGR) of 12 percent between 2011 and 2016, which is significantly higher than the IPC market average of 9 percent. HiTEN 2013 (High Temp. Electronics Network) July 8-10, 2013, Oxford, UK www.imaps.org/hiten Interop Las Vegas 2013, May 6-10, 2013 Las Vegas, NV. www.interop.com 2013 IEEE Symposium on EMC August 5-9, 2013, Denver, Co. www.emc2013.org EASTEC 2013, May 14-16, 2013 W. Springfield, MA. www.easteconline.com EOS/ESD Symposium 2012, September 8-13, 2012, Las Vegas, Nev. www.esda.org Electronic System Technologies Conference May 20-23, 2013, Las Vegas, Nev. www.estc.ipc.org IEEE ECTC 2013, May 28th – 31, 2013 Las Vegas, Nev. www.ectc.net IEEE ECEE 2013 September 15-19, 2013, Denver, CO. www.ecce2013.org IMAPS 2013, September 29- Oct. 3rd, 2013 Orlando, Fla. www.imaps.org Advancements in Thermal Management 2013 June 6-7, 2013, Denver, Colo. www.ThermalNews.com Battery Power 2013, June 6-7, 2013, Denver, CO. www.batterypoweronline.com Design East, September 30-Oct. 3rd, 2013Boston, MA. http://east.ubmdesign.com OSP Expo, October 8-10, 2013 Dallas, Texas www.ospmag.com 2013 IEEE Symposium on EMC, August 5-9, 2013 Denver, Co. www.emc2013.org Remote Monitoring and Control 2013, Dec. 12-13, 2013 Las Vegas, Nev. www.RemoteExpo.com May/June 2013 www.ElectronicsProtectionMagazine.com 29 http://www.imaps.org/hiten http://www.interop.com http://www.emc2013.org http://www.easteconline.com http://www.esda.org http://estc.ipc.org http://www.ecce2013.org http://www.ectc.net http://www.imaps.org http://www.ThermalNews.com http://east.ubmdesign.com http://www.batterypoweronline.com http://www.ospmag.com http://www.emc2013.org http://www.RemoteExpo.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - May/June 2013

Electronics Protection - May/June 2013
Newer Technology Releases Next-Generation Power2U AC/USB In Wall Charging Solution
Raritan Boosts its DCIM Leadership Position with dcTrack 3.0
Specifiers of Enclosures for Components in Outdoor Applications: Be Aware of Material Selection Issues
Realizing the Many Benefits of Power System Relay Upgrades
How to Protect Electronic Circuits from Power Surges
A Little Diamond Goes a Long Way: Overcoming Thermal Limitations to Enable Next Generation Technology
Hardware Technology Eliminates Problems Caused by Using Traditional Captive Screws
Managing Lithium-Chemistry Batteries: It’s Mostly About Their Temperature
Protecting and Improving Electronic Components Performance
Advancements in Thermal Management Conference Preview
One Stop Systems Introduces nanoCUBE Desktop Expansion
Select-A-Shield RF Shielded Tent Closure System Is Non-Radiating
Thermoelectric Air Conditioner Delivers Maximum Cooling Regardless of Power Supply
On-line, Double-Conversion UPS from Emerson Network Power Earns Energy Star Qualification
Dirak Introduces a New Swinghandle
Dual-Cure Conformal Coating Eliminates Need for Additional Processing
Industry News
Calendar of Events

Electronics Protection - May/June 2013

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