Electronics Protection - July/August 2013 - (Page 10)

Feature Standards-Based Design & Electronic Packaging Solutions Marc Caiola, Channel & Marketing Manager, North America Pentair Equipment Protection, Schroff To ensure consistent, high-speed data transfer and system reliability, sensitive electronic components require effective packaging solutions. These solutions are not only employed to protect against environmental factors, such as dust, moisture, shock and vibration, and potential structural damages, but also to protect electronics against thermal challenges that can lead to overheating and system failure. All market segments are facing cost pressures along with the need to keep up with rapid technology changes and highbandwidth capacity issues. In an effort to reduce costs, a focus on total cost of ownership (TCO), which includes lifecycle maintenance and upgrade costs, points to an ideal scenario for specifying and using standards-based solutions across multiple systems and applications. Utilizing a standards-based electronic packaging solution reduces upfront development costs and technical risk, while providing the latest proven technologies in a cost-effective platform solution. Furthermore, working with the standards community allows access to a vendor ecosystem that has future-proofed product roadmaps to help mitigate risks in today’s constantly changing market. From components ranging from card guides, retainers and conductioncooled assemblies (CCAs) to subracks and cabinets, A complete standards-based packaging design engineers can solution consists of multiple components, assemble a packaging ranging from card guides and retainers to solution to enclose, shield subracks and cabinets. and cool electronics in a variety of applications. Realizing the Benefits of Standards-Based Design An organization can achieve significant benefits by developing open standards-based solutions. Open standards organizations have established comprehensive equipment design specifications, which are also supported with a large supplier ecosystem. Two notable standards-based design committees include the PCI Industrial Computer Manufacturers Computer Group (PICMG) and VME International Trade Association (VITA). In today’s rapidly changing technology trends, coupled with a highly cost-conscious business climate, standards-based design can significantly reduce product development costs while accelerating time-to-market. Standards-based design also delivers the promise of interoperability and future-proof, while providing access to an extensive range of pre-certified, configurable, Commercial-OffThe-Shelf (COTS) electro-mechanical hardware and components. Thus, design engineers and their respective organizations can leverage the power of open standards to complement in-house core competencies, no longer needing to completely design, build or integrate proprietary electronic solutions. 10 Designing the System A complete standards-based packaging solution typically consists of a system chassis or electronic subrack, backplane, printed circuit boards (PCB), power supply, thermal management (such as a fan tray or assembly) and electro-mechanical hardware, such as card guides, retainers, front panels and PCB accessories. Some examples of standards-based bus architectures include AdvancedTCA, CompactPCI, CompactPCI Plus IO, VME, VME64 and VPX. In addition to mechanical, thermal management and power requirements, design engineers should first consider the required mounting configuration when specifying a system or subrack electronic packaging solution. Vertical and horizontal dimensions are specified in Rack Units (RU) and Horizontal Pitch (HP), respectively. One rack unit equals 1.75 inches (44.45 mm) high. For example, a subrack might be available in sizes ranging from 3U to 12U. The Eurocard PCB standard uses HP to measure the horizontal width of rack mounted electronic equipment. One HP unit equals 0.2 inches (5.08 mm) wide. For instance, a standard 19 inch system chassis covers 95HP and typically allows for 84HP of usable horizontal space. Card-Lok Retainers A secure clamping force is essential in avoiding damage to board module assemblies or printed circuit boards (PCBs). Cardlok retainers are designed to secure PCBs when shock or vibration is present. These conditions typically cause the PCB channel to flex, which can result in system failure or accidental ejection of the board. The card-lok retainer provides force to ensure secure clamping at the connector side, the backplane side and the top and bottom edges of the PCB. Card-lok retainers are available in various lengths, individual wedge dimensions, mounting configurations and finishes to satisfy diverse application requirements. Conduction-Cooled Assemblies CCAs are generally used when passive free air convection or active forced air cooling is not possible, such as in space applications, or where creating airflow with moving parts might affect the reliability of the system. Featuring a robust, lightweight aluminum design, CCAs deliver high thermal conductivity, while ensuring sufficient structural support. CCAs also assist in avoidCCAs deliver high thermal ing exposure of critical electronics conductivity, while ensuring to dust or contaminants. CCAs are sufficient structural support. available in numerous configuration sizes and finishes to fit various platform and application requirements, including, but not limited to, VME, CompactPCI, VPX and AdvancedMC. Subracks A standard subrack consists of two side panels and at least four horizontal rails. For a benign environment, a simple subrack featuring a sheet of metal and snap-in plastic guides should be used. For areas requiring a more ruggedized solution, subracks are available in models that can achieve shock resistances from 1g up to 25g to satisfy diverse applications, ranging from standard industrial to robust transportation, light military use and ruggedlevel products. Some models feature a multi-function system with July/August 2013 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - July/August 2013

Electronics Protection - July/August 2013
Newer Technology Releases Next-Generation Power2U AC/USB In Wall Charging Solution
Subzero Engineering Introduces PolarXpress DCiM SaaS Monitoring Solution
Specifiers of Enclosures for Components in Outdoor Applications: Be Aware of Material Selection Issues
Formable Phase Change Materials as Latent Heat Sinks for Portable Electronic Devices
How to Protect Electronic Circuits from Power Surges
Diamond Heat-Spreaders: Growth Methods and Applications
Standards-Based Design & Electronic Packaging Solutions
Reducing Room-Level Bypass Airflow Creates Opportunities to Improve Cooling Capacity and Operating Costs
Harnessing Laboratory Wind Tunnels
New DVR Enclosure with Prepackaged Thermoelectric Cooler
New Silver Conductive Aqueous Based Sodium Silicate System for EMI/RFI Shielding
Citizen and MechaTronix LED Cooling Cooperate On New Generation CitiLED COB’s
Eaton Expands 5P UPS Product Line to Provide Efficient Protection for Any IT Environment
Flex-Block System Puts Free-Standing Enclosures on New Footing
Gore Introduces Acoustic Vent for Protecting Electronic Devices
Industry News
Calendar of Events

Electronics Protection - July/August 2013

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