Electronics Protection - July/August 2013 - (Page 22)

Thermal Citizen and MechaTronix LED Cooling Cooperate On New Generation CitiLED COB’s With the rising demand for standard and validated cooling solutions, MechaTronix has recently launched a series of passive and active LED cooling solutions for the latest generation Citizen CitiLED COB’s. These standard LED cooling products offer a safe and validated thermal solution for all the Citizen CitiLED packages, going from the CLL020/CLL022 package size over the CLL030/CLL032 and CLL040/ CLL042 all the way up to the CLL050/CLL052. The MechaTronix LED coolers are validated both for the first generation Citizen CitiLED COB’s as well as the second generation that was launched earlier in 2013. This means any Citizen user can use an off the shelf validated LED cooling solution for 500 lumen all the way up to 14.000 lumen. Thermal validation tests have been performed on both the nominal driving currents of the CitiLED COB’s as well as on the maximal ratings under different ambient temperatures. With this data on hand users can prediction the thermal results they will get in their design and the related life time they can expect of their luminaire Besides the mounting holes for fixation of the CitiLED COB’s, these LED coolers are standard foreseen for mounting of the newest LED holders from BJB and Tyco Electronics Connectivity, what gives easy solder less mounting options and allow users to implement reflectors from various manufacturers like Ledil and Kathod without the need for extra modifications. Mitsubishi Plastics Reduces Costs to Produce High-Modulus Grade Pitch-based Carbon Fiber Mitsubishi Plastics, Inc.’s DIALEAD has successes in nearly halving the production costs of its ultra-high-modulus grade of pitchbased carbon fiber, which excels in heat conductivity and rigidity, by increasing the number of filaments per carbon fiber bundle. The current product type has been used in limited applications such as heat release materials of electronics devices loaded into artificial satellites due to high costs. The reduction of DIALEAD K13C6U production costs is expected to expand sales of the product for its application in wider fields such as parts and materials for electronics devices, heat sinks, LEDs and automobiles. There are currently two main classifications of carbon fiber; polyacrylonitrile (PAN)-based and pitch-based. Since pitch-based carbon fiber has excellent tensile modulus (rigidity) and heat conductivity, it is possible to produce carbon-fiber-reinforcedplastics (CFRP) with the near zero coefficient of thermal expansion. However, the high rigidity that makes it difficult to handle pitch-based carbon fiber during secondary processing, and the higher price of the product compared to that of metallic materials and PAN-based carbon fiber presented challenges for the carbon fiber manufacturers to expand the market. DIALEAD K13C2U has been used in heat dissipation materials 22 of electronics devices loaded into artificial satellites, etc. with its highest-class rigidity (tensile modulus: 900 GPa) and thermal conductivity of 620 W/mK, almost triple that of aluminum. As it is in the highest price category of pitch-based carbon fiber, cost reduction for the product was necessary to expand its scope of applications. Responding to this challenge, the company has developed DIALEAD K13C6U kept the same level of modulus and thermal conductivity and raised the production efficiency by tripling the number of filaments per fiber bundle to 6,000 (6K) from 2,000 (2K) by optimization of graphitization processes. As a result of this, the production costs have been almost halved. Heat dissipation capacity is an important design factor to realize smaller, lighter and higher function parts and materials for electronics equipment, LED lighting and automobiles. The lightweight pitch-based DIALEAD K13C6U carbon fiber with heat dissipation performance and rigidity is expected to be adopted as heat release materials for general purposes. Applied Math Modeling Releases CoolSim 4.1 Data Center Design Software Applied Math Modeling, Inc. has released CoolSim 4.1, the next revision of the company’s modeling software. As the industry’s only cloud-based implementation, CoolSim 4.1 continues to add important ease of use and modeling features with each iteration. CoolSim 4.1 allows users to model raised floor designs, non-raised floor designs and mixed environments that use ducted cold air supplies with or without containment. Also, because CoolSim is cloud-based, multiple design variations can be studied concurrently. “Unlike other data center design tools that require users to wait for the results of one simulation prior to submitting another, CoolSim allows multiple simulations to be submitted concurrently, thereby speeding up design optimization by orders of magnitude,” said Paul Bemis, CEO, Applied Math Modeling. “With CoolSim 4.1, users are free to consider many more design alternatives prior to selecting the optimal design for a given data center environment.” User productivity improvements for CoolSim 4.1 include a snap feature that allows rapid alignment of geometry and objects in the model, making the creation of duct work and underfloor obstructions easy to create and model. Improvements in the CoolSim automated post processing module allow the user directed control of output reports. Reports can be customized to provide users with temperature and pressure contours, airflow streamlines and animated images. The integration of improved meshing technology resulting from a partnership with ANSYS provides automatic unstructured hex dominate meshing for true geometry representation, improving model accuracy while reducing overall model processing time. CoolSim’s mesh control allows users to refine the mesh and balance trade-offs between computational cost and solution accuracy. Additional objects for both the CoolSim object library allows users to quickly and easily find, drag and drop drag and drop objects from the advanced library storage system. Objects can be sorted not only by model number, but also other parameters including cooling capacity, flow rate, and/or type. CoolSim 4.1 is based upon an all new model building environ- July/August 2013 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - July/August 2013

Electronics Protection - July/August 2013
Newer Technology Releases Next-Generation Power2U AC/USB In Wall Charging Solution
Subzero Engineering Introduces PolarXpress DCiM SaaS Monitoring Solution
Specifiers of Enclosures for Components in Outdoor Applications: Be Aware of Material Selection Issues
Formable Phase Change Materials as Latent Heat Sinks for Portable Electronic Devices
How to Protect Electronic Circuits from Power Surges
Diamond Heat-Spreaders: Growth Methods and Applications
Standards-Based Design & Electronic Packaging Solutions
Reducing Room-Level Bypass Airflow Creates Opportunities to Improve Cooling Capacity and Operating Costs
Harnessing Laboratory Wind Tunnels
New DVR Enclosure with Prepackaged Thermoelectric Cooler
New Silver Conductive Aqueous Based Sodium Silicate System for EMI/RFI Shielding
Citizen and MechaTronix LED Cooling Cooperate On New Generation CitiLED COB’s
Eaton Expands 5P UPS Product Line to Provide Efficient Protection for Any IT Environment
Flex-Block System Puts Free-Standing Enclosures on New Footing
Gore Introduces Acoustic Vent for Protecting Electronic Devices
Industry News
Calendar of Events

Electronics Protection - July/August 2013

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