Electronics Protection - September/October 2013 - (Page 18)
Aderis Releases New Line of Structural
Rogers Introduces Poron SlimGrip Foam
Aderis has launched a line
of hybrid structural adhesives,
called INES for INterlaced
Elastomer NetworkS. The INES
line combines the performance
of three different adhesive
bonding technologies: the resistance and mechanical strength
that only epoxies can usually
offer, the elasticity provided
by polyurethanes (PUR) and the fast assembly rate enabled by
methacrylates (MMA). This structural adhesive combines elongation, low modulus and high mechanical performance with high
impact, peel and shear strength, for a range of temperatures from
-80° to 140°C.
There is no need for a primer with INES to obtain performance.
The bond remains flexible, yet allows rapid handling of the bonded
parts. INES can be used to join a broad range of heterogeneous
materials found in the market, including treated metals, engineering composites, thermoplastics (ABS and PC), glass and zinc. INES
has added elasticity (70 percent pure elasticity over an elongation
range) in combination with high strength (250 kg/cm² for shear
on steel and up to 100 kg/3.5 cm for peel). These properties offer
added technical performance for high-stress bonding applications. Thanks to its structural performance, the INES line acts like
a damper jack when the assembly is subjected to vibrations, over a
range of temperatures from -80° to 140°C (the product’s two glass
transition temperatures). The damping feature is also acoustic. INES
mitigates noise, especially when it is used on automotive parts. In
addition the INES range performs at ambient temperature, which
means considerable time and energy savings for users.
Low Viscosity, Two Component Epoxy has an
Extended Working Life and Low Exotherm
Suitable for large castings, Master
Bond EP21LVSP6 combines a low
viscosity and low exotherm with a
working life of three to five hours.
It can also be used for bonding,
sealing and coating applications in
aerospace, electronic, electrical, optical and other specialty industries.
Formulated for potting and encapsulation, Master Bond EP21LVSP6 is
particularly suited for larger castings.
This two part epoxy offers has
a non-critical one to one mix ratio, by weight or volume and its
processing is facilitated with color coding. Part A is clear and Part
B is amber clear. It is formulated to cure at room temperature or
more rapidly at elevated temperatures.
EP21LVSP6 bonds well to a variety of similar and dissimilar
substrates such as metals, composites, glass, ceramics, rubbers and
plastics. It has a tensile strength exceeding 7,000 psi and a tensile
lap shear strength greater than 2,500 psi. The system is able to
withstand chemicals including water, oil, fuel, acids and bases. It
is a competent electrical insulator over the temperature range
of -60°F to 250°F. EP21LVSP6 is available in a variety of packing
options, including ½ pint, pint, quart, gallon and five gallon kits as
well as a gun dispenser.
When space is tight and display performance is critical, Poron SlimGrip foam
provides a correct fit. SlimGrip foam is
Rogers’ softest material yet. With a starting thickness of 0.5 mm and the ability to
squeeze into gaps less than 0.05 mm, no
space will go unfilled.
SlimGrip foam requires one-third
the force to achieve 0.05 mm thickness,
all while maintaining good rebound properties. That means less
work is required for even greater performance. Additionally, this
material is 50 percent more effective at dust sealing than competitive materials, further protecting the integrity of displays.
SlimGrip foam is provided on a 0.05 mm release PET film. When
the PET is removed, a tacky surface is exposed, leaving behind no
incompressible layers. The tacky surface may assist in the temporary placement of gaskets, further easing production. With
incredible compressibility, resistance to compression set and reliable dust sealing performance, SlimGrip foam has made a valuable
addition to the Poron family of materials.
Light-Curable Encapsulants Reach Full Cure in
Dymax Dual-Cure 9101, 9102, and 9103
are resilient, chip-encapsulant materials designed with a UV/Visible light and
secondary ambient moisture-cure system,
making them well suited for encapsulation applications where shadowed areas
are present. These materials cure tack free
after UV cure, so boards can be handled
sooner with less potential for damage. The
two-day moisture cure (versus the seven
days typical with other systems) shortens
the time for further handling as well as
final testing and assembly.
These three new materials have varying viscosities of 7,000,
17,000, and 25,000 cP, allowing for performance and dispensing to
be optimized, and are jet dispensable for more accurate placement
and more efficient material usage. The cured materials are flexible
and expand with heat, reducing stress on board components. No
refrigeration is required for transporting the uncured material, so
no additional associated costs are incurred.
Gore VE9 Adhesive Vents Extend Life of
W. L. Gore & Associates has expanded its line of Gore Protective Vents with a product engineered to increase the reliability
of outdoor electronic enclosures. The series VE9 Adhesive Vent
enables outdoor electronic enclosures to be designed with normal
seals and gaskets without the need to upgrade to more costly ruggedized seals and gaskets.
Integrating the Series VE9 Adhesive Vent into an enclosure
is easy, thanks to the durable adhesive and all ePTFE construction that allows the vent to be mounted on either the interior or
exterior of the housing, depending on protection rating needs. This
enables enclosure manufacturers to realize design flexibility and
while increasing reliability. Combined with Gore’s UL-listed ePTFE
membrane, the series VE9 vent offers a typical airflow of 1,150 ml/
min/cm2. This allows for fast equalization of pressure caused by
sudden temperature changes.
Table of Contents for the Digital Edition of Electronics Protection - September/October 2013
Geist Unveils Rapid Deployment Data Center Environmental Monitoring System
Enabling Effective Thermal Management with DCIM
Predicting Gasket Performance: SE Measurements with a TEM Cell to Study Gasket Reliability
Rack Containment 101
The Nine Core Elements of DCIM
Using Electronic Locking Solutions to Secure Enclosures and Meet Storage Compliance Needs
Hammond’s HJ Series Ticks All the Boxes
Rogers Introduces Poron SlimGrip Foam
Ferrite Suppressors Clear Interference
Fujipoly Thermal Sheets are a Cooling Influence on LED Lighting
GE Introduces TLE Series UPS Platform
Gore PolyVent XL Improves Reliability of Large Outdoor Enclosures
IMI Sensors Launches Linear Adjust Mechanical Vibration Switch
Calendar of Events
Five Ways to Realize Server Room Profitability
Electronics Protection - September/October 2013