Electronics Protection - September/October 2013 - (Page 18)

Contamination Aderis Releases New Line of Structural Bonding Adhesives Rogers Introduces Poron SlimGrip Foam Aderis has launched a line of hybrid structural adhesives, called INES for INterlaced Elastomer NetworkS. The INES line combines the performance of three different adhesive bonding technologies: the resistance and mechanical strength that only epoxies can usually offer, the elasticity provided by polyurethanes (PUR) and the fast assembly rate enabled by methacrylates (MMA). This structural adhesive combines elongation, low modulus and high mechanical performance with high impact, peel and shear strength, for a range of temperatures from -80° to 140°C. There is no need for a primer with INES to obtain performance. The bond remains flexible, yet allows rapid handling of the bonded parts. INES can be used to join a broad range of heterogeneous materials found in the market, including treated metals, engineering composites, thermoplastics (ABS and PC), glass and zinc. INES has added elasticity (70 percent pure elasticity over an elongation range) in combination with high strength (250 kg/cm² for shear on steel and up to 100 kg/3.5 cm for peel). These properties offer added technical performance for high-stress bonding applications. Thanks to its structural performance, the INES line acts like a damper jack when the assembly is subjected to vibrations, over a range of temperatures from -80° to 140°C (the product’s two glass transition temperatures). The damping feature is also acoustic. INES mitigates noise, especially when it is used on automotive parts. In addition the INES range performs at ambient temperature, which means considerable time and energy savings for users. Low Viscosity, Two Component Epoxy has an Extended Working Life and Low Exotherm Suitable for large castings, Master Bond EP21LVSP6 combines a low viscosity and low exotherm with a working life of three to five hours. It can also be used for bonding, sealing and coating applications in aerospace, electronic, electrical, optical and other specialty industries. Formulated for potting and encapsulation, Master Bond EP21LVSP6 is particularly suited for larger castings. This two part epoxy offers has a non-critical one to one mix ratio, by weight or volume and its processing is facilitated with color coding. Part A is clear and Part B is amber clear. It is formulated to cure at room temperature or more rapidly at elevated temperatures. EP21LVSP6 bonds well to a variety of similar and dissimilar substrates such as metals, composites, glass, ceramics, rubbers and plastics. It has a tensile strength exceeding 7,000 psi and a tensile lap shear strength greater than 2,500 psi. The system is able to withstand chemicals including water, oil, fuel, acids and bases. It is a competent electrical insulator over the temperature range of -60°F to 250°F. EP21LVSP6 is available in a variety of packing options, including ½ pint, pint, quart, gallon and five gallon kits as well as a gun dispenser. 18 When space is tight and display performance is critical, Poron SlimGrip foam provides a correct fit. SlimGrip foam is Rogers’ softest material yet. With a starting thickness of 0.5 mm and the ability to squeeze into gaps less than 0.05 mm, no space will go unfilled. SlimGrip foam requires one-third the force to achieve 0.05 mm thickness, all while maintaining good rebound properties. That means less work is required for even greater performance. Additionally, this material is 50 percent more effective at dust sealing than competitive materials, further protecting the integrity of displays. SlimGrip foam is provided on a 0.05 mm release PET film. When the PET is removed, a tacky surface is exposed, leaving behind no incompressible layers. The tacky surface may assist in the temporary placement of gaskets, further easing production. With incredible compressibility, resistance to compression set and reliable dust sealing performance, SlimGrip foam has made a valuable addition to the Poron family of materials. Light-Curable Encapsulants Reach Full Cure in Shadowed Areas Dymax Dual-Cure 9101, 9102, and 9103 are resilient, chip-encapsulant materials designed with a UV/Visible light and secondary ambient moisture-cure system, making them well suited for encapsulation applications where shadowed areas are present. These materials cure tack free after UV cure, so boards can be handled sooner with less potential for damage. The two-day moisture cure (versus the seven days typical with other systems) shortens the time for further handling as well as final testing and assembly. These three new materials have varying viscosities of 7,000, 17,000, and 25,000 cP, allowing for performance and dispensing to be optimized, and are jet dispensable for more accurate placement and more efficient material usage. The cured materials are flexible and expand with heat, reducing stress on board components. No refrigeration is required for transporting the uncured material, so no additional associated costs are incurred. Gore VE9 Adhesive Vents Extend Life of Outdoor Electronics W. L. Gore & Associates has expanded its line of Gore Protective Vents with a product engineered to increase the reliability of outdoor electronic enclosures. The series VE9 Adhesive Vent enables outdoor electronic enclosures to be designed with normal seals and gaskets without the need to upgrade to more costly ruggedized seals and gaskets. Integrating the Series VE9 Adhesive Vent into an enclosure is easy, thanks to the durable adhesive and all ePTFE construction that allows the vent to be mounted on either the interior or exterior of the housing, depending on protection rating needs. This enables enclosure manufacturers to realize design flexibility and while increasing reliability. Combined with Gore’s UL-listed ePTFE membrane, the series VE9 vent offers a typical airflow of 1,150 ml/ min/cm2. This allows for fast equalization of pressure caused by sudden temperature changes. September/October 2013 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - September/October 2013

Geist Unveils Rapid Deployment Data Center Environmental Monitoring System
Enabling Effective Thermal Management with DCIM
Predicting Gasket Performance: SE Measurements with a TEM Cell to Study Gasket Reliability
Rack Containment 101
The Nine Core Elements of DCIM
Using Electronic Locking Solutions to Secure Enclosures and Meet Storage Compliance Needs
Hammond’s HJ Series Ticks All the Boxes
Rogers Introduces Poron SlimGrip Foam
Ferrite Suppressors Clear Interference
Fujipoly Thermal Sheets are a Cooling Influence on LED Lighting
GE Introduces TLE Series UPS Platform
Gore PolyVent XL Improves Reliability of Large Outdoor Enclosures
IMI Sensors Launches Linear Adjust Mechanical Vibration Switch
Industry News
Calendar of Events
Five Ways to Realize Server Room Profitability

Electronics Protection - September/October 2013