Electronics Protection - Summer 2014 - (Page 26)
New 3-Phase Thermoelectric Air Conditioners
TECA Corp. now offers thermoelectric enclosure coolers
for systems with 3-phase power.
TECA's product line of 3-phase
electronic enclosure coolers offers high cooling capacity ratings
from 2,200 to 6,000 BTU/hr. Utilizing thermoelectric technology,
TECA's 3-phase air conditioners
are reliable, maintenance free and
do not require filters, coolant or
chemicals of any kind. The only
moving parts are high quality industrial and military grade fans.
TECA's 3-phase air conditioners for electrical cabinets excel in high
ambient temperatures and can perform in a wide range of environments including NEMA-12, NEMA-4 and NEMA-4X.
Each 3-phase air conditioner has a built in temperature controller with TECA's Eco-Mode, an energy efficient feature in which the
air conditioner uses passive cooling. This passive cooling limits the
requirement for active cooling and thus reduces operating costs.
As with all of TECA's high efficiency air conditioners, unique
design features are a benefit. Each 3-phase thermoelectric air conditioner is built with a centrally-located power input cord and large
bolting flange for user-friendly installation. Robust hardware and
environmental gasket are included, as well as Heat/Cool versions.
New Easy Handling Thermal Compound
Sarcon SPG-30A from Fujipoly
is a thermal interface option for
circuit boards with a large surface area, many components
and delicate solder points. The
form-in-place silicone compound
completely fills all spaces, gaps and
protrusions when compressed by a
heat sink or spreader. The material's
high viscosity and ultra-low compression force are well suited for
applications with gaps ranging from 0.30 mm to 1.0 mm.
Once applied, Sarcon SPG-30A delivers a thermal conductivity of
3.2 W/m°K with a thermal resistance of only 0.3°Cin2/W. The form
stable thermal compound requires no heat curing, will not cause
corrosion on metal surfaces, and maintains all initial properties
across a wide temperature range (-40°C to 150°C). Fujipoly's Sarcon SPG-30A material is available in 30 ml tubes, 325 ml cartridges.
Controller Enhances Thermal Verification and
Burn-in of Electronics
inTEST Thermal has released a new
control platform for Sigma Systems' cryogenically and mechanically cooled thermal
chambers and plates. Burn-in and testing
of components, sensors and PCBs typically
involves temperature cycling from two to
four points, which can be time consuming
to setup and run. The TS Controller provides touch-screen and remote interfacing
to set up and transfer thermal profiles,
view data and trends, and log diagnostics.
Setting up test parameters (from -185°C to 500°C) such as set
points, ramp speed, hold time, probe source, auxiliary ports, and
number of temperature loops is faster over previous systems.
Display status includes temperature data and trends for the device
Summer 2014 * www.ElectronicsProtectionMagazine.com
under test, the chamber and set points. Diagnostics such as cryo
valve usage, ambient temperature, chiller and blower runtimes, and
enclosure temperature assists with maintaining system performance. An optional independent fail safe protects units under test
New Capabilities added Purkay Labs Audit-Buddy
Purkay Labs has announced new
capabilities for Audit-Buddy, a portable tool that measures temperature
and humidity without touching the
server. With Purkay Labs' Audit-Mate
V2.0 PC program, users can now
upload data collected by Audit-Buddy
directly into the PC without the need
for a USB drive.
Audit-Buddy is a portable tool that captures both real-time and
long term scans of the data center environment, without the need
for any infrastructure modifications or downtime. Audit-Mate 2.0 is
a complimentary PC program that gives users an alternative means
to pre-configure the Audit-Buddy settings and upload Audit-Buddy
data. This update complements Purkay Labs' recently released
three-step "Optimize Your Data Center" package, which helps users
to quickly pinpoint, diagnose and fix airflow issues on a rack-byrack basis.
HP Unveils Modular Cooling System that Cools
High-Density Data-Center Racks to 50 kW
HP has released the HP Modular Cooling System (HP MCS) 100
and 200, close-coupled cooling systems that
can handle rack power and cooling requirements from 5,000 to 50,000 W without adding
to the current heat load on the existing conventional data center cooling system.
Using the cooling efficiency of water, HP
MCS 100 and 200 can effectively cool fully
populated high-density racks, keeping them
cool and hot-spot free, reducing the overall
heat load on the facility, and saving valuable
floor space and cooling resources.
Following the front-to-back cooling principle used in most server designs, HP MCS 100
and 200 evenly distribute cold air at the front of the equipment
rack. Each server receives an adequate air supply, regardless of its
position within the rack or the density of the rack. As the servers
expel warm exhaust air out the rear of the rack, the fan modules
re-direct the warm air into the heat exchanger module. The air is
re-cooled and then re-circulated to the front of the rack.
Any condensation that forms is collected in the heat exchanger
module and sent through a discharge tube to a condensation tray
located in the base of the enclosure. The HP MCS 100 offers 5,000
to 35,000 watts of capacity, and the HP MCS 200 offers 10,000 to
50,000 watts of capacity. Each model is capable of cooling one or
Water can remove 3,500 times the amount of heat as compared
to an equivalent volume of air. HP MCS 100 and 200 take full
advantage of the cooling efficiency of water. Additional HP MCS
100 and 200 benefits include hot-swappable fans, a full-featured
Environment Manager accessible locally or remotely using a Web
browser or smart phone. Additionally, redundant power automatically detects power failures and switches to alternate source while
there's the ability to drain condensation through evacuation pipe,
and there's support for third-party standard-rack servers.
Table of Contents for the Digital Edition of Electronics Protection - Summer 2014
New High Efficiency LED Technology Benefits From Best Practice Thermal Management Design
Passive Thermal Management of Lithium-ion Batteries Using Phase Change Materials
Considerations for Powering Military Applications
How Thermal Ground Plane and Compact Air-Cooled Heat Sinks are Revolutionizing Thermal Management
Access Control Solutions for Railway Infrastructure
20 Data Center Downtime Study Puts Focus on Maximum Protection
Cooling and Shielding in the Right-Sized Enclosure
Calendar of Events
Electronics Protection - Summer 2014