Electronics Protection - Summer 2014 - (Page 26)

Thermal New 3-Phase Thermoelectric Air Conditioners TECA Corp. now offers thermoelectric enclosure coolers for systems with 3-phase power. TECA's product line of 3-phase electronic enclosure coolers offers high cooling capacity ratings from 2,200 to 6,000 BTU/hr. Utilizing thermoelectric technology, TECA's 3-phase air conditioners are reliable, maintenance free and do not require filters, coolant or chemicals of any kind. The only moving parts are high quality industrial and military grade fans. TECA's 3-phase air conditioners for electrical cabinets excel in high ambient temperatures and can perform in a wide range of environments including NEMA-12, NEMA-4 and NEMA-4X. Each 3-phase air conditioner has a built in temperature controller with TECA's Eco-Mode, an energy efficient feature in which the air conditioner uses passive cooling. This passive cooling limits the requirement for active cooling and thus reduces operating costs. As with all of TECA's high efficiency air conditioners, unique design features are a benefit. Each 3-phase thermoelectric air conditioner is built with a centrally-located power input cord and large bolting flange for user-friendly installation. Robust hardware and environmental gasket are included, as well as Heat/Cool versions. New Easy Handling Thermal Compound Sarcon SPG-30A from Fujipoly is a thermal interface option for circuit boards with a large surface area, many components and delicate solder points. The form-in-place silicone compound completely fills all spaces, gaps and protrusions when compressed by a heat sink or spreader. The material's high viscosity and ultra-low compression force are well suited for applications with gaps ranging from 0.30 mm to 1.0 mm. Once applied, Sarcon SPG-30A delivers a thermal conductivity of 3.2 W/m°K with a thermal resistance of only 0.3°Cin2/W. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40°C to 150°C). Fujipoly's Sarcon SPG-30A material is available in 30 ml tubes, 325 ml cartridges. Controller Enhances Thermal Verification and Burn-in of Electronics inTEST Thermal has released a new control platform for Sigma Systems' cryogenically and mechanically cooled thermal chambers and plates. Burn-in and testing of components, sensors and PCBs typically involves temperature cycling from two to four points, which can be time consuming to setup and run. The TS Controller provides touch-screen and remote interfacing to set up and transfer thermal profiles, view data and trends, and log diagnostics. Setting up test parameters (from -185°C to 500°C) such as set points, ramp speed, hold time, probe source, auxiliary ports, and number of temperature loops is faster over previous systems. Display status includes temperature data and trends for the device 26 Summer 2014 * www.ElectronicsProtectionMagazine.com under test, the chamber and set points. Diagnostics such as cryo valve usage, ambient temperature, chiller and blower runtimes, and enclosure temperature assists with maintaining system performance. An optional independent fail safe protects units under test from damage. New Capabilities added Purkay Labs Audit-Buddy Purkay Labs has announced new capabilities for Audit-Buddy, a portable tool that measures temperature and humidity without touching the server. With Purkay Labs' Audit-Mate V2.0 PC program, users can now upload data collected by Audit-Buddy directly into the PC without the need for a USB drive. Audit-Buddy is a portable tool that captures both real-time and long term scans of the data center environment, without the need for any infrastructure modifications or downtime. Audit-Mate 2.0 is a complimentary PC program that gives users an alternative means to pre-configure the Audit-Buddy settings and upload Audit-Buddy data. This update complements Purkay Labs' recently released three-step "Optimize Your Data Center" package, which helps users to quickly pinpoint, diagnose and fix airflow issues on a rack-byrack basis. HP Unveils Modular Cooling System that Cools High-Density Data-Center Racks to 50 kW HP has released the HP Modular Cooling System (HP MCS) 100 and 200, close-coupled cooling systems that can handle rack power and cooling requirements from 5,000 to 50,000 W without adding to the current heat load on the existing conventional data center cooling system. Using the cooling efficiency of water, HP MCS 100 and 200 can effectively cool fully populated high-density racks, keeping them cool and hot-spot free, reducing the overall heat load on the facility, and saving valuable floor space and cooling resources. Following the front-to-back cooling principle used in most server designs, HP MCS 100 and 200 evenly distribute cold air at the front of the equipment rack. Each server receives an adequate air supply, regardless of its position within the rack or the density of the rack. As the servers expel warm exhaust air out the rear of the rack, the fan modules re-direct the warm air into the heat exchanger module. The air is re-cooled and then re-circulated to the front of the rack. Any condensation that forms is collected in the heat exchanger module and sent through a discharge tube to a condensation tray located in the base of the enclosure. The HP MCS 100 offers 5,000 to 35,000 watts of capacity, and the HP MCS 200 offers 10,000 to 50,000 watts of capacity. Each model is capable of cooling one or two racks. Water can remove 3,500 times the amount of heat as compared to an equivalent volume of air. HP MCS 100 and 200 take full advantage of the cooling efficiency of water. Additional HP MCS 100 and 200 benefits include hot-swappable fans, a full-featured Environment Manager accessible locally or remotely using a Web browser or smart phone. Additionally, redundant power automatically detects power failures and switches to alternate source while there's the ability to drain condensation through evacuation pipe, and there's support for third-party standard-rack servers. http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - Summer 2014

Editor's Choice
New High Efficiency LED Technology Benefits From Best Practice Thermal Management Design
Passive Thermal Management of Lithium-ion Batteries Using Phase Change Materials
Considerations for Powering Military Applications
How Thermal Ground Plane and Compact Air-Cooled Heat Sinks are Revolutionizing Thermal Management
Access Control Solutions for Railway Infrastructure
20 Data Center Downtime Study Puts Focus on Maximum Protection
Cooling and Shielding in the Right-Sized Enclosure
Enclosures
Thermal
Power
Hardware
EMI/EMC/ESD
Industry News
Calendar of Events

Electronics Protection - Summer 2014

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