Electronics Protection - Summer 2014 - (Page 3)
Advanced Plasma Technology Protects
Electronics from Water and Contaminants
Uyemura International Corp. has
brought vacuum plasma treatment
technology (Nanofics) to electronic
manufacturing companies (EMS)
and board makers in the US, Canada
and Mexico. This low pressure
plasma technology allows manufacturers to apply conformal coatings
to electronic components, and to
fully assembled products such as
headsets, hearing aids and mobile
phones. It provides a highly effective
and cost-efficient surface finish to
protect board surfaces prior to assembly.
Nanofics technology uses a low pressure, dry plasma system to
deposit polymer nanocoatings with high levels of long-term hydrophobicity and oleophobicity. It is inherently "green," and does not
generate chemical waste. It also offers the distinctive advantage of
being usable as an encapsulate for the complete board, with Z axis
conductivity that allows electrical connection through the coating.
These coatings can also be soldered through.
Sabic Collaborates with Cima Nanotech on
Transparent Polycarbonate Film
With smart materials being one of the fastest growing areas
of materials technology, Sabic and Cima NanoTech have jointly
development of a plastics industry first, a transparent conductive
The material has the potential
to further enhance performance,
enable new applications and open
doors for new product designs.
This could translate into faster response touch screens for consumer
electronics, transparent "no-line"
anti-fogging capabilities for automotive windows, better EMI shielding effectiveness for electronics,
and transparent WiFi/Bluetooth antennas for mobile devices like
smartphones, tablets, laptops and all-in-one computers.
The collaboration, leveraging both Cima NanoTech's proprietary
Sante nanoparticle technology with Sabic's Lexan film, a polycarbonate material, has resulted in the development of a series of
transparent conductive materials that are lightweight with excellent transparency, outstanding conductivity and high flexibility.
Cima NanoTech worked with Sabic's team of scientists to jointly
develop materials that not only meet the requirements of existing
industries, but also stretches the possibilities for exciting opportunities by breaking boundaries faced with current materials.
iTRACS Evolves DCIM to Better Manage
Network Connections in the Data Center
iTRACS has released Converged Physical Infrastructure Management (CPIM) 3.2. This latest release enables faster workflows,
enhanced integration tools and a new level of automated connectivity management featuring the integrated imVision automated
infrastructure management solution.
The integration of the imVision platform with CPIM extends
iTRACS' capabilities with intelligent connectivity management. This
integration offers CPIM users real-time visibility into the physical
cabling infrastructure that connects IT assets in the data center.
Using imVision's asset and connectivity information, CPIM
customers can optimize the capacity of their infrastructure by
identifying and eliminating unused network and patch panel ports
and other patching inefficiencies. They can reduce the time to
resolve issues and enhance network availability by pinpointing and
resolving connectivity issues, such as unscheduled changes, that
can cause downtime. They can also ensure the fastest time-to-value for new IT and network assets by leveraging imVision's guided
work order administration and real time information updates.
CPIM users will now have an additional source of connectivity
intelligence offering real-time visibility into every port and panel.
The flow of connectivity data from imVision is seamless. The
connectivity database only has to be created once, allowing both
platforms to leverage the data.
Hammond Manufacturing Develops Enclosure
Designed to House the Raspberry Pi Model B
The 1593HAM is available in translucent blue, grey and black. The enclosure
features a stylish rounded design with
apertures for all the I/O interfaces and supported accessories. There are no fixings; the
Raspberry Pi board clips into the base and,
in turn, the top half of the enclosure then
clips into the base. A catch secures the
assembly and allows the case to be easily
opened if required.
All I/O capability is directly accessible
without having to modify the enclosure.
The camera module can be fitted through a slot in the top, or it
can be screwed to the inside of the top cover with a hole provided
for the lens. A cut out in the split line between the two halves of
the case provides access to the GPIO header.
Two USB ports, the RJ45 LAN port, the SD carrier, the audio
and video RCA ports, the micro USB power-in connector and a
HDMI interface are all accessible through apertures of the correct
size and shape in the sides of the enclosure. Two captive slots are
moulded into the base to enable the enclosure to be attached to a
surface; for stand-alone applications, small feet are also supplied.
Free Sizing Software for Thermoelectric
TECA Corp. has launched its
newest sizing software to estimate
thermoelectric air conditioner
requirements. Available as a free
download from TECA's website the
sizing software features an intuitive and user-friendly interface.
With parameters defined by the
user, the free software quickly and
accurately estimates cooling requirements and suggests the best
TECA air conditioners to use. Selectable environment, power input
and mounting options help the user narrow the choices.
Other features include a notepad and interactive performance
charts. The user's notes and the software solutions can be saved
and printed. The software is available now on TECA's website:
www.thermoelectric.com/2010/ssw/software.htm as a download.
www.ElectronicsProtectionMagazine.com * Summer 2014
Table of Contents for the Digital Edition of Electronics Protection - Summer 2014
New High Efficiency LED Technology Benefits From Best Practice Thermal Management Design
Passive Thermal Management of Lithium-ion Batteries Using Phase Change Materials
Considerations for Powering Military Applications
How Thermal Ground Plane and Compact Air-Cooled Heat Sinks are Revolutionizing Thermal Management
Access Control Solutions for Railway Infrastructure
20 Data Center Downtime Study Puts Focus on Maximum Protection
Cooling and Shielding in the Right-Sized Enclosure
Calendar of Events
Electronics Protection - Summer 2014