Electronics Protection - Winter 2014 - (Page 28)
New microPEM TackScrew Fasteners for
microPEM TackScrew fasteners
from PennEngineering integrate
self-clinching technology for
permanent sheet-to-sheet attachment while also incorporating
a thread-like feature to allow
fastener removal when necessary.
This combination adds functionality to the original microPEM
TackPin fastener product line for
thin sheet attachment applications, especially compact electronics.
TackScrew fasteners can even be reinstalled one time if desired.
These hardened stainless steel Type TS fasteners can serve as
practical solutions to attach a top sheet or panel to a base material in applications ranging from laptops, notebooks, and tablet
computers to smart phones, gaming and hand held devices, and
As suitable replacements for micro screws, TackScrew fasteners will not require the added costs of locking patches, threaded
inserts, tapped holes or driver bits for initial installation, or potential rework due to cross threading and driver bit "cam out." The
clinch technology resists vibrational loosening in service and the
fastener's low-profile head can add cosmetic value.
The fasteners install in thin sheets by preparing properly
sized mounting holes in the sheet to be attached and the base
panel. After inserting the fastener into these holes, the fastener
is pressed into place. The fastener then clinches into the base
panel and its head subsequently holds the top sheet (as thin as 0.2
mm/0.008 inch) firmly and permanently in place. The base panel
can be as hard as HRB 89 / HB 187 or less on the Rockwell "B" and
Brinell scales, respectively, and as thin as 0.91 mm /0 .036 inch.
Hirose Develops Low-Profile Power Connector
Hirose has developed the
DF65 series connector, a small,
connector that provides highcurrent capacity and high
reliability for power supplies,
up to 4 Amps (with 24 AWG
wire) and 50 V AC/DC. A low
profile connector, the DF65
series features a narrow 1.7
mm pitch and 1.8 mm mated
height. The vertical mating feature maximizes available board
space and reduces assembly time.
The DF65 series introduces Hirose's advanced locking system
developed for high vibration applications, which makes it wellsuited for use with a DC jack or battery pack. The double locking structure enhances reliability by reinforcing the engagement
between the socket and the header. The positive lock secures the
socket into the header, and produces over 5N cable pull strength
in the upper direction. The friction lock system ensures complete
locking by producing a final tactile click, and prevents the socket
from floating after mating.
The two point contact structure provides optimum reliability by
stabilizing contact resistance and restraining temperature rise. The
DF65 connector's molded structure prevents solder wicking and
accidental unmating, while the header design provides increased
cable retention and enhanced lance strength.
The small size, high power capability, and ruggedness makes the
Winter 2014 * www.ElectronicsProtectionMagazine.com
DF65 series wire-to-board connector well-suited for a wide range
of applications including industrial machinery, industrial robotics,
portable medical devices, laptops, tablets, digital cameras, LCD
TVs, home electronics, white goods, and LED lighting.
With an operating temperature range of -35°C to 105°C, the
DF65 series connector limits contact resistance to 10 M ohms
maximum with an insulation resistance of at least 100 M ohms.
Curtiss-Wright Expands its Hybricon Family of
Fabric40 OpenVPX Backplanes
Curtiss-Wright Corp.'s Defense Solutions division has
expanded its family of 40 Gbps
Gen3 OpenVPX backplanes
with the introduction of three
Hybricon central-switched Fabric40 OpenVPX backplanes and
two Gen3 OpenVPX-optimized
Fabric40 OpenVPX pass-through
backplanes. Curtiss-Wright's Fabric40 family of backplanes is designed to enable end-to-end transmission of the high speed data required for the most demanding
ground and airborne C4ISR and EW deployed applications.
The Gen3 OpenVPX backplanes support full-speed, bottleneckfree distribution of data over, Gen3 PCI-Express, 40 Gbps Ethernet
or Infiniband fabrics. Featuring patent-pending signal integrity
technology to ensure application reliability and reduced risk, these
high performance backplanes enable the design of a new class
of embedded subsystems capable of delivering previously unobtainable levels of performance to support numerous demanding
defense and aerospace EW, SIGINT, RADAR applications, such as
the real-time detection and identification of signals of interest.
Fabric40 Gen3 OpenVPX backplanes are designed for use in
both development and rugged deployed applications. In air-cooled
or conduction-cooled development chassis, the new backplane
speeds and eases the integration of compute-intensive radar,
signal and image processing for ground or airborne platforms.
Curtiss-Wright can also design application-specific configurations
to meet a customer's individual requirements.
New IP 68 Quick Fix Cable Glands from OKW
New Quick Fix Cable Glands from OKW
speed up installations and make it easier
to work when access is difficult. Quick Fix
Cable Glands have been designed to be
fitted from the outside without the use of
special tools. They will fit both OKW and
non-OKW enclosures. Installation involves
simply pushing the cable gland into a
drilled hole, centring it and tightening an
external locknut which has a left-hand
thread to ensure it remains firm. The
cable can then be fed through.
Not only are the glands easy to use but they also save space because only a very narrow flange extends into the enclosure. Each
Quick Fix Cable Glands is rated to IP 68 as standard for its seal and
strain relief. The glands are designed for enclosure wall thicknesses
from 0.04 inches to 0.15 inches.
Four sizes are available: M16 (cable Ø 0.20 to 0.39 inches), M20
(cable Ø 0.31 to 0.51 inches), M25 (cable Ø 0.43 to 0.67 inches),
M32 (cable Ø 0.59 to 1.26 inches). They are molded in polyamide
in Light Gray (RAL 7035) as standard. Custom colors are available
Table of Contents for the Digital Edition of Electronics Protection - Winter 2014
EMI Compliance: Choosing the Right Shielding and Gasketing
Thermal-Fluid Modeling for Flat Thin Heat Pipes/Vapor Chambers
Increase Rack Cooling Efficiency and Solve Heat-Related Problems
Seven Essential Cabinet Design Considerations for Protecting 19 Inch Electronics
A Better Alternative to Heat Pipes: Integrating Vapor Chambers Into Heat Sinks
Common IP Testing Failures and How to Avoid Them
Electronics Protection - Winter 2014