Electronics Protection - Winter 2014 - (Page 31)
IDTechEx Research Sees Structural Electronics
Market Potentially Reach $60bn by 2025
Aircraft, and later cars, will have a nervous system like a human
being, instantly alerting to touch and damage. Aircraft will have
no passenger windows, instead displaying a moving color picture
of what you would see from a window in the position where the
window used to be, thanks to a smart inside to the fuselage - an
All this is structural electronics, a large new market assessed in
the IDTechEx report, "Structural Electronics 2015-2025: Applications, Technologies, Forecasts". This report gives ten year forecasts
for structural electronics and for its key enabling technologies
employed or envisaged such as printed electronics. Electric vehicles particularly need structural electronics so their numbers are
forecasted for the next ten years, in 37 categories, something no
other analyst has attempted.
The technologies used now and in the future are assessed,
from in-mold electronics to electronic 3D printing of load-bearing
structures, structural metamaterials and energy harvesting such
as structural photovoltaics. They are related to each other in the
report with indication of maturity and potential.
A spectacular future awaits, aircraft are being developed that
stay aloft on nothing more than sunshine thanks to structural solar
cells in the whole wing and elsewhere. Large boats circumnavigate
the world on sunshine thanks to solar decks, solar roads are being
developed and car bodies that store electricity thanks to structural
supercapacitors are being trialed. Smart skin on vehicles, buildings and other structures is assessed in this comprehensive report.
Smart skin can increasingly perform many functions, including
ubiquitous sensing, electricity generation, electricity storage and
diversion of lightning strikes around aircraft made of insulating
On a smaller scale, it has been shown that the protective insulation on cabling can be replaced with structural electronics and
dumb printed circuit boards are being made load-bearing and
smart. A common factor is saving space, weight and cost while
Fall 2014 North American Survey Results Reveal
Top Data Center Concerns
Data center monitoring capabilities, availability and changes
in technology are the leading top-of-mind issues for data center
managers, according to a fall survey of data center users from
Emerson Network Power.
The fall installment of the biannual survey polled members of
the Data Center Users' Group (DCUG), an association of influential
data center, IT and facility managers, captured input from more
than 130 respondents across North America. The questions covered a variety of data center topics, including data center monitoring and management, capacity constraints, third-party colocation providers, energy efficiency and heat and power densities.
The survey results show that, for the second time this year,
technology change continues to be an increasing concern on the
minds of data center professionals. In the Spring 2014 survey, concerns over technology change rose from eight to number five; it
continues to climb this fall as it tied for second place. When asked
to identify their top three facility/network concerns, 35 percent of
respondents cited adequate monitoring/data center management
capabilities, followed by 34 percent for both availability/uptime
and technology changes. Concerns over energy efficiency dropped
from 44 percent in the fall of 2013 to 32 percent in this survey.
"As reflected in our recent 'Data Center 2025' report, data
centers are undergoing massive changes in technology at an
increasing pace. Concern over this continues to rise among data
center managers, as advances in technology and interconnectivity
are forcing data centers to support more critical, interdependent
devices and IT systems," said Bob Miller, vice president, global
solutions sales, Emerson Network Power in North America, and a
member of the DCUG board of directors. "While energy efficiency
is still a concern, focus is clearly shifting toward greater availability
and the need for more capacity."
More than one third of survey respondents indicated that they
are able to accommodate additional compute capacity without
constraints - but available power, cooling and floor space were
listed as restraining the growth capabilities of almost two thirds of
the respondents. Seventy-eight percent indicated they have unplugged unused servers (i.e. ghost servers) in the past 12 months.
Fifty-five percent of respondents have increased the temperature in their data center during the course of the year. With 75
percent of responses, 'resilient and highly available' were listed
as the greatest importance of data center capabilities. Thirty-two
percent of respondents cited they were extremely likely to incorporate commissioning services in their next data center project.
Atrodyne Corp. Acquires TDI Power
Astrodyne Corp. has acquired TDI Power (TDI) from private
owners. TDI designs and manufactures power supplies and
integrated systems for semiconductor manufacturing, industrial,
medical, mil/aero and other end markets. TDI targets demanding
applications requiring precise voltage and/or current in harsh or
highly variable conditions.
Astrodyne plans to continue to operate TDI Power's Hackettstown, NJ and Shenzhen, China manufacturing facilities, and will
look to create synergies that will provide benefits to customers.
"We are excited to welcome the employees of TDI Power to
the Astrodyne family. They have built an impressive brand and
have unmatched engineering capabilities in higher power applications, which complements Astrodyne's low-to-medium power
solutions and EMI filters," said Pete Kaczmarek, president and CEO
of Astrodyne. "We look forward to continuing to build upon the
company's track record of engineering excellence, quality, and
Verotec Custom Enclosures Help Keep the
London Underground Running
The London Underground carried 1.26 billion passengers in the
last year, making it one of the busiest networks in the world. To
help keep it running smoothly, Verotec used its TecServ+ Project
Service operation to design and manufacture bespoke enclosures
used to house some critical switching and interfacing equipment.
One of London Underground's System Integrators needed
application-specific housings for a system upgrade. The requirements, specifications and concept sketches were supplied to
Verotec. The TecServ+ operation, which incorporates design, engineering, project management, compliance testing and manufacture, initially produced 3D model files and detailed manufacturing
drawings for customer review. Once approved, initial physical
concept prototypes, supplied unfinished to reduce costs and
time, were produced. Following customer evaluation, modified
versions of the original prototypes were signed off for production, and Verotec supplied the first batch within the required
short lead time.
www.ElectronicsProtectionMagazine.com * Winter 2014
Table of Contents for the Digital Edition of Electronics Protection - Winter 2014
EMI Compliance: Choosing the Right Shielding and Gasketing
Thermal-Fluid Modeling for Flat Thin Heat Pipes/Vapor Chambers
Increase Rack Cooling Efficiency and Solve Heat-Related Problems
Seven Essential Cabinet Design Considerations for Protecting 19 Inch Electronics
A Better Alternative to Heat Pipes: Integrating Vapor Chambers Into Heat Sinks
Common IP Testing Failures and How to Avoid Them
Electronics Protection - Winter 2014