Electronics Protection - Spring 2015 - (Page 30)
Global Market for Thermal Management
Products to Reach $15.56 Billion by 2018
The thermal management industry is moving toward comprehensive solutions to cool electronics and paving the way for the
electronics industry to develop high-performance applications.
As a result, the dynamic in this market has not been one where
there is a move toward a single technology or product that
replaces others. The tendency is for systems designers to look at
the entire problem and evaluate multiple options and combinations for a solution.
According to a recently published report from iRAP, Inc., "Electronic Thermal Management - Technology, Materials, Devices, New
Developments, Industry Structure and Global Markets," the world
market for thermal management products is predicted to grow
from about $8.8 billion in 2013 to $15.56 billion by 2018, at an
average annual growth rate (CAGR) of 12.1 percent.
Thermal management denotes the array of problem-solving
design tools and material technologies that systems manufacturers apply to regulate the unwanted heat caused by the normal
functioning of an electronic system. Increasing power densities
and decreasing transistor dimensions are hallmarks of modern
computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well
as accelerating research progress on high conductivity materials.
The trend line of the thermal management industry aligns with
the development of technology in the semiconductor, microprocessor and computer industries. For every advance in performance
of these systems, there is a corresponding increase in the operating heat generated by the system. It is probably more accurate to
state that the development of thermal management as an industry
is the result of a synergy of solutions constantly engineered to
manage excess heat in today's electronic systems.
There are four main segments in thermal management technologies: hardware, software, interfaces and substrates. According to the new iRAP report, the hardware segment maintained its
number one position with largest share of the market in 2013.
This is followed by substrates, thermal interface materials and the
The overview of end-user trends shows the largest market in
2013 was for computers, followed by telecommunications, industrial/military industries, medical/office equipment, automotive and
The thermal management industry is made up of companies
from several industries that supply cooling solutions to manufacturers of electronic systems. The industry itself is structured
around the applications that require thermal management. It is
made up of component producers, specialty chemical companies,
consultants and programmers.
Future Resource Engineering Launches to Help
Data Centers Reduce Energy Usage, Enhance
Operations and Increase Profitability
RLE Technologies has launched a new division, Future Resource
Engineering. The enterprise will systematically identify facility and
operational inefficiencies in enterprise or embedded data centers
and implement turnkey solutions to reduce power usage and increase the data center's bottom line. Future Resource Engineering
administers a three step process to provide data center owner/
operators with tangible power savings with no IT downtime or
movement of equipment. Their Efficiency Engineers will perform
facility evaluations, efficiency reporting and implementation.
Facility evaluations will determine energy and operational
Spring 2015 * www.ElectronicsProtectionMagazine.com
inefficiencies. This free service determines if an engagement with
Future Resource Engineering can produce a significant enough
ROI for the customer to justify moving forward.
Efficiency reporting includes a complete energy audit that
measures facility metrics and quantifies precisely how much savings a customer can expect to see. Recommendations typically
include: adjusting airflow management, implementing or upgrading equipment monitoring and controls, improving operational
protocols, increasing cooling efficiency and other best practices.
During this phase, the Future Resource Engineering team also
works closely with local utility companies to validate their findings
and help determine potential energy reduction incentives.
Lastly, implementation of the suggestions outlined in the efficiency report. Future Resource Engineering is one of the few
companies that can also execute on recommendations. This
results in little disruption to the daily facility operations and no
downtime. Additionally, the company is one of the few that will
help clients reduce the financial risk of implementing the efficiency plan by utilizing utility incentives and vendor neutral solutions
to offset project costs. The anticipated utility incentives can be
deducted from the total project price up front, essentially transferring much of the risk from the customer to Future Resource
Engineering if a project doesn't meet expected efficiency goals.
BICSI Releases Updated Edition of Global Data
BICSI has announced an updated release of its flagship standard, ANSI/BICSI 002-2014, Data Center Design and Implementation Best Practices. Considered the foundation standard for data
center design around the world, ANSI/BICSI 002-2014 continues
its mission to provide requirements, guidelines and best practices
applicable to any data center.
Data center construction and expansion is predicted to continue steadily over the next ten years worldwide. With the increasing
focus on reliability and efficiency, the initial design is more important than ever. Thus, today's data center designer is required to
have knowledge of mechanical, electrical and telecommunications
systems and how they interact-areas not typically found in the
same reference manual or standard.
Now featuring 500 pages of content, the 2014 edition of BICSI
002 focuses on adding or expanding information on critical data
center design and infrastructure topics, including modular and
"container" data centers, data center infrastructure management
(DCIM) and building systems, DC power, hot and cold aisles,
multi-data center architecture and data center service outsourcing and energy efficiency.
Rogers Corp. Signs Definitive Agreement to
Acquire Arlon, LLC
Rogers Corp. has signed a definitive agreement to acquire
Arlon, LLC, currently owned by Handy & Harman Ltd. for $157
million, subject to closing and post-closing adjustments. The
transaction, which is subject to regulatory clearances, is expected
to close in the first half of 2015. Rogers intends to finance the
transaction through a combination of cash and borrowings under
an existing bank credit facility.
"This transaction is truly a unique strategic fit for both Rogers
and Arlon, said Bruce Hoechner, president and CEO, Rogers. "We
are energized by the opportunity to serve our customers with our
complementary capabilities and technologies in circuit materials
and engineered silicones and to enhance value for our shareholders. We look forward to closing this acquisition as another signifi-
Table of Contents for the Digital Edition of Electronics Protection - Spring 2015
Predictive Modeling: The Next Frontier in Data Center Condition Maintenance
Don't Forget the Batteries
Military Aircraft Power
Pumped Two Phase Cooling Solutions for Challenging Thermal Management Applications
Identifying the Ideal Mechanical PCB Hardware for Electronic Systems
Bridging the Technology Gap: The Importance of Cyber and Physical Security within the Data Center
Waterproof Mobile Device Protection without Compromising Acoustic Quality
Electronics Protection - Spring 2015