Electronics Protection - Summer 2016 - (Page 4)
Knock Down Server Rack Rated for Heavy Duty Applications
Equipto Electronics newest rack may take a minimalist
approach on design, but offers the same strength and durability of much higher-priced equipment racks. Designed
for use in server rooms, data centers and other applications requiring multiple open racks, Equipto's KD series
open rack is very cost competitive. With knock down (KD)
assembly, the rack can ship for a much lower dimensional
weight than all-welded frames.
Maximum weight capacity is a full ton (1,000# with casters), which more-than-handles a maximum load of modern
19 inch mount servers and peripherals. The standard rack
measures 75 by 23 by 36 inches and weighs less than 120
lb. The design is based on 16 main 14 gauge structural
steel sections, including four 41U rack rails. Field assembly
takes less than 30 minutes.
Like other Equipto Electronics rack systems, the KD series is manufactured
in the US with fully RoHS compliant materials. Standard paint is wrinklefinish black powder coat, with other types available. Additional options
include rails, casters and shelves. Leveling feet are standard.
Future Facilities Release 10 of its 6SigmaET Thermal
At the heart of Release 10 lies an improved unstructured gridding capability.
This advanced technology makes solving up to six times faster by altering the
granularity of its grids to account for
varying levels of complexity in the model.
This allows users to run more variations
of their designs, large models with greater
accuracy and in ever-shorter timeframes.
Responding to industry suggestions,
Release 10 makes key thermal analysis tasks even simpler, with improved
configuration of the simulation environment including altitude and solar
radiation. 6SigmaET now also calculates the weight of each part so engineers can easily optimize their product to reduce weight. Through these
enhancements, engineers can use 6SigmaET to develop designs for an even
greater array of real-life and hypothetical scenarios, without the need for
Other features include a new in-built Package Builder, which allows users to
automatically generate individual IC component models simply by defining
a list of preset parameters. Through this interface, users can create detailed
integrated circuits thermal models for inclusion within their product designs, allowing them to analyze internal temperatures of complex ICs.
Release 10 also takes advantage of 6SigmaET's new partnership with cloud
platform Rescale, allowing simulations to be solved on demand via high
performance computing in the cloud. Reducing solve times and enabling
users to solve large and detailed simulations.
Summer 2016 * www.ElectronicsProtectionMagazine.com
Volume 14, Issue 2
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Table of Contents for the Digital Edition of Electronics Protection - Summer 2016
Electronics Protection - Summer 2016
Common Coolant Types and Their Uses in Liquid Cooling Systems
The Benefits of Vertical Integration for Customized EMI Shielding Products and Services
Cool It Your Way: Versatile Cooling for Electronics Enclosure
Heat Pipes and Vapor Chambers – What’s the Difference?
Securing Electronics in Modern Railway Systems
Calendar of Events
Electronics Protection - Summer 2016