Electronics Protection - Summer 2017 - 28

Industry News
The Road to Fully Flexible Electronics and the
Role of Flexible Encapsulation

Flexible consumer electronic devices are now a reality, and as forecasted by IDTechEx in the launch of the
first ever market research report on the topic of barrier
films for electronics almost ten years ago, innovation in
encapsulation was one of the critical requirements that
needed to be met in order to realize commercially viable
consumer products.
Today, challenges of previous years are giving their place
to new ones, being an integral part of bringing innovation to market, and they are discussed in detail in the
new report by IDTechEx Research, Barrier Layers for Flexible Electronics 2017-2027: Technologies, Markets, Forecasts, where it is forecasted that the market for flexible
encapsulation will reach approximately $913 million by
2027. By now, the discussion has moved on from "when
are we going to see the first flexible display?" to "Should
I integrate the deposition of barrier layers in my manufacturing process or identify a barrier film supplier?" he
answer to the latter is, it seems, very application specific.
Quantum dot (QD) backlit LCDs are a great example of
a new technology being launched into the market with
a barrier film as part of its componentry. There's a level
of skepticism on what type of barrier film is required in
a quantum dot enhancement film for instance, in order
to protect the dots from moisture ingress, and that has
led to a slower than expected initial growth. Suppliers of
barrier film and display manufacturers are trying to find
a balance between water vapor transmission rate requirements, price points, and decisions on whether cadmium toxicity will be a major drawback in the long run.
Nanoco's work with Samsung seems to have answered
the question for the Korean electronics giant that's
moved towards cadmium free quantum dot solutions.
Enabling fully flexible OLED displays is also a key target
for Samsung, as well as for LG and most every other developer of OLED technology worldwide, and moving from
current generations of devices -which start with a flexible
display but end up in a rigid final product- to fully flexible, bendable, and foldable form factors is the endgame.
Display manufacturers choose the integrated approach
of thin film encapsulation (TFE) in line with the display
manufacturing process in this case, rather than the use of
a barrier film bonded onto the display with an adhesive.
Of course, in order to achieve these fully flexible end
products, additional challenges such as alignment issues,
flexibility of the rest of the components in the complete
portable device etc. must also be addressed. From a barrier perspective, the key challenge is to make encapsula28

Summer 2017 * www.ElectronicsProtectionMagazine.com

tion even better than it is today, with a reduced thickness
profile. Atomic layer depositions seems to hold some of
the answers to this challenge.
The latest news from technology developers and tool
suppliers are showing a surge of interest in ALD, for the
superior quality of deposited inorganic layer in the barrier stack that can be achieved, that's practically defectfree, and in addition at a reduced thickness. Lower
thickness allows for higher flexibility when compared to
inorganic layers of higher thickness produced via PE-CVD
for instance, the workhorse in barrier film manufacturing
to date. We are now seeing companies like LG working
with Jusung Engineering as their tool suppliers, bringing
their proprietary hybrid PE-CVD/ ALD tool into the game,
thus benefiting from the higher speed of PE-CVD and the
excellent quality of an ALD layer into the overall deposited stack.

Eaton Furthers Commitment to Data Center
Innovation with Open Compute Project
Foundation Membership

Power management company Eaton has joined the Open
Compute Project (OCP) Foundation, a collaborative community focused on redesigning hardware technology to
efficiently support the growing demands on compute
infrastructure. As a Community Level Member, Eaton will
contribute its power management technology, including its ePDU G3 rack mounted power distribution units
(PDUs), to helping the community achieve its mission of
designing, using and enabling mainstream delivery of the
most efficient designs for scalable computing.
"Eaton has a long-standing record of enabling data
center scalability and energy efficiency with our power
management hardware, software and services," said Joe
Skorjanec, ePDU product manager, Eaton Distributed
Power Solutions. "Through collaboration with the Open
Compute community, Eaton's solutions can play a critical
role in this initiative as we continue to power the future
of data center innovation."
Founded in 2011 by Facebook, Intel and Rackspace, OCP
reimagines hardware, making it more efficient, flexible
and scalable. Through creating global community of
technology, leaders are working together to break open
the black box of proprietary IT infrastructure to rapidly
increase the pace of innovation in, near and around the
data center and beyond to achieve greater choice, customization and cost savings.
Eaton's ePDU G3 portfolio of PDUs provides data center professionals with best-in-class power distribution
with a full line of Basic, Metered Input, Metered Outlet


http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - Summer 2017

Editor's Choice
Smart Electronic Adhesives for Microelectronics – Enabled by Low Viscosity Nanocomposite Materials
Sheilding Tips and Tricks
Digital Analysis Brings Convenience and Accuracy to Power Measurement
Enclosures
Thermal
EMI/EMC/ESD
Power
Hardware
Industry News
Electronics Protection - Summer 2017 - Cover1
Electronics Protection - Summer 2017 - 2
Electronics Protection - Summer 2017 - Editor's Choice
Electronics Protection - Summer 2017 - Smart Electronic Adhesives for Microelectronics – Enabled by Low Viscosity Nanocomposite Materials
Electronics Protection - Summer 2017 - 5
Electronics Protection - Summer 2017 - 6
Electronics Protection - Summer 2017 - 7
Electronics Protection - Summer 2017 - Sheilding Tips and Tricks
Electronics Protection - Summer 2017 - 9
Electronics Protection - Summer 2017 - 10
Electronics Protection - Summer 2017 - 11
Electronics Protection - Summer 2017 - 12
Electronics Protection - Summer 2017 - 13
Electronics Protection - Summer 2017 - 14
Electronics Protection - Summer 2017 - 15
Electronics Protection - Summer 2017 - Digital Analysis Brings Convenience and Accuracy to Power Measurement
Electronics Protection - Summer 2017 - 17
Electronics Protection - Summer 2017 - 18
Electronics Protection - Summer 2017 - 19
Electronics Protection - Summer 2017 - Enclosures
Electronics Protection - Summer 2017 - 21
Electronics Protection - Summer 2017 - Thermal
Electronics Protection - Summer 2017 - 23
Electronics Protection - Summer 2017 - EMI/EMC/ESD
Electronics Protection - Summer 2017 - 25
Electronics Protection - Summer 2017 - Power
Electronics Protection - Summer 2017 - Hardware
Electronics Protection - Summer 2017 - Industry News
Electronics Protection - Summer 2017 - 29
Electronics Protection - Summer 2017 - Cover4
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https://www.nxtbook.com/nxtbooks/webcom/ep_2014spring
https://www.nxtbook.com/nxtbooks/webcom/ep_20140102
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https://www.nxtbook.com/nxtbooks/webcom/ep_20120910
https://www.nxtbook.com/nxtbooks/webcom/ep_20120607
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