Electronics Protection - Summer 2017 - 7

Feature
The bulk thermal conductivity of silica used in NANOPOX E series is ~1 W/mK.
To improve thermal properties even further, Evonik Nutrition and Care GmbH
has developed nano concentrates based on nano scaled alumina under the
trade name NANOPOX T. Al2O3 has a heat conductivity of ~30 W/mK and is
therefore likely to further improve the thermal conductivity of underfills by
enabling the next generation of microelectronics.

Summary

Silica and alumina nano particle composites NANOPOX E and NANOPOX T
provide new benefits that are helping to overcome today's limitations and push
back boundaries to meet tomorrow's needs. The drastic decrease in viscosity
levels, the prevention of sedimentation, and the ability to fill even the smallest
gaps are the basis for the next generation of high-end adhesives and potting
materials. NANOPOX, provides maximum thermal conductivity whilst achieving
the highest filler content levels and keeping t viscosity levels under control.

Figure 6. Enlarged picture of marked
section in figure 5. Nanoparticles shown
have direct contact to the surface of
the chip. This maximizes the heat transfer from the chip into adhesive and
can therefore improve the overall heat
removal in a given IC package.

References
1. C. Roscher, Tiny particles, huge effect, European Coatings Journal, Vinzenz, 4/2003
2. William M. Haynes (Hrsg.), CRC Handbook of Chemistry and Physics. A ready-reference Book of chemical and physical Data. 92. Auflage. CRC Press, Boca Raton FL u. a. 2011,
3. Alex Mangroli and Kris Vasoya, Optimizing thermal and mechanical performance in PCBs, Stablcor Inc., Costa Mesa,
Calif., USA, Global SMT & Packaging - December 2007
4. IPC, Guideline for Selection and Application of Underfill Material for Flip Chip and other Micropackages , J-STD-030
Draft 7 - Dec 2000
5. R. Kochetov , Thermal and Electrical Properties of Nanocomposites, Including Material Processing, Delft 2012
6. Martin Josef Anglhuber Untersuchungen zum Verhalten nanoskalig gefüllter Epoxidharzformstoffe unter elektrischer
Beanspruchung, München 2011
7. F. Bauer et al., Nano/Micro Particle Hybrid Composites
for Scratch and Abrasion Resistant Polyacrylate Coatings,
Macromol. Mater. Eng, 291 , WILEY-VCH Verlag , 2006
8. S. Sprenger, Epoxy Resin Composites with surfacemodified silicon dioxide nanoparticles: a review, Journal of
Applied Polymer Science, 2013

IF IT'S OUTSIDE,
MAKE IT INTEGRA.

Authors
Dr. Andreas Funck, Head of AT Electronics, Evonik Nutrition & Care GmbH, andreas.funck@evonik.com
Torsten Lubenow, AT Electronics, Evonik Nutrition & Care
GmbH, torsten.lubenow@evonik.com

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Table of Contents for the Digital Edition of Electronics Protection - Summer 2017