Automotive Engineering - June 2021 - 29

PRODUCT
BRIEFS
SPOTLIGHT: ADHESIVES
Light-curable adhesives
Dymax's
(Torrington,
Conn.) new
white paper describes
the benefits
of using
light-curable
adhesives for
active alignment
of camera modules,
optical
components and LiDAR assemblies used in automotive applications.
Authored by Dr. Dave Dworak, " Dymax Active
Alignment Adhesives and Their Use in LiDAR and Optical
Assemblies " discusses the differences between passive alignment
and active alignment, the importance of accurate positioning
of components and the cost benefits associated with
the use of light-curable materials in the assembly process.
The paper features detailed information on the physical and
mechanical properties of Dymax active alignment adhesives,
as well as the results of their compression shear strength
compared to leading market products on a variety of substrates.
The adhesives offer manufacturers many additional
benefits such as rapid, " on-demand " cure with UV/LED light,
heat cure for shadow areas, and very low shrinkage, which is
critical to achieving optimal component alignment.
For more information, visit http://info.hotims.com/79442-400
Corrugated tubing
Solvay (Brussels, Belgium) and
Maincor Rohrsysteme GmbH &
Co. KG (Schweinfurt, Germany)
have created a technique to manufacture
a more flexible, extruded
corrugated tubing with varying
wall thicknesses and diameters, which allows greater lightweighting
potential. Solvay says this advance will help meet
new thermal management design challenges stemming from
combining internal combustion engine (ICE) and e-mobility
technologies including batteries, e-motors, and power electronics.
This follows the introduction of Solvay's Ryton PPS
mono-layer extrusion grade Ryton XE3500BL, a high-performance
resin now fully optimized to produce corrugated tubing
and commercially available worldwide. Solvay's Ryton PPS
has thermal stability up to 200°C (392°F), dimensional stability
at elevated temperatures and in harsh environments, mechanical
strength, ductility, toughness, chemical resistance
and is inherently flame retardant, the company claims.
For more information, visit http://info.hotims.com/79442-402
AUTOMOTIVE ENGINEERING
Adhesive performance
Avery Dennison
Performance Tapes
(Painesville, Ohio) latest
bonding study with
Armacell Component
Foams (Chapel Hill,
N.Carolina) focuses on
helping converters
evaluate the performance
of Avery Dennison Core Series Portfolio adhesive
products. Foam bonding is affected by the foam's base
polymer, thickness and cell type. Adhesion to foam is affected
by factors such as adhesive mass, pressure, compression,
lamination speed and temperature. This study was conducted
under the following conditions: Core Series Portfolio
adhesive products were backed with a 2-mm (0.079-in) PET
film and trimmed to a 1-in (25-mm) width; two sample sets
were laminated to Armacell component foam; and all samples
were tested at 180° peel adhesion at 12 in/min (305
mm/min). The resulting study classifies the performance of
Core Series adhesives when used with Armacell component
foams. Using the study in conjunction with the Avery
Dennison " Core Series Product Selection Tool " allows converters
to evaluate bonding strength along with other application
requirements to quickly select the right adhesive for
their unique application.
For more information, visit http://info.hotims.com/79442-401
600-V CoolMOS chip family
Infineon Technologies'
(Munich, Germany) 600-V
CoolMOS S7 family offers two
new optimized devices for
static switching applications:
the industrial-grade CoolMOS
S7 10 mΩ and the automotivegrade
CoolMOS S7A. The CoolMOS S7 10 mΩ has a unique
low on-resistance (R DS(on)) for 600 V superjunction
MOSFETs, making it suitable for applications where minimal
conduction losses are critical, such as off-the-shelf solid-state
relays (SSR). In contrast, the automotive-grade CoolMOS S7A
addresses system performance requirements set by solidstate
circuit breakers (SSCB) and diode paralleling/replacement
for high power/performance designs in automotive applications,
such as the high voltage (HV) eFUSE, HV eDisconnect
battery disconnect switch, as well as on-board chargers.
Infineon claims the CoolMOS S7 10 mΩ and CoolMOS S7A
chips come with the lowest RDS(on) in the market.
For more information, visit http://info.hotims.com/79442-403
June 2021 29
http://info.hotims.com/79442-400 http://info.hotims.com/79442-401 http://info.hotims.com/79442-402 http://info.hotims.com/79442-403
Automotive Engineering - June 2021

Table of Contents for the Digital Edition of Automotive Engineering - June 2021
