Automotive Engineering - February 2022 - 23

PRODUCT
BRIEFS
SPOTLIGHT: POWER ELECTRONICS
Compact power module for
hybrids, EVs
Infineon
Technologies
(Neubiberg,
Germany) has
introduced its
EasyPACK 2B
EDT2 750 V power
module. The device
can provide a
power supply of
up to 50 kW and
230 A rms and is intended for inverter applications in hybrid
and electric vehicles. A key feature of Infineon's EDT2 (Electric
Drive Train) technology is higher efficiency in low-load conditions.
The EDT2 chip ensures significantly lower energy loss
and is claimed to outperform Infineon's previous-generation
chips by 20%. The unit also features a " plug-and-play " capability,
which simplifies module integration. The EasyPACK 2B's
packaging requires 30% less surface area than Infineon's
HybridPACK 1 and is fully certified to AQG324 standards.
For more information, visit http://info.hotims.com/82329-400
SPOTLIGHT: ON-BOARD PROCESSORS
Imaging radar processor
Internal navigation system for Level 2 ADAS
Aceinna (Tewksbury,
Massachusetts) has unveiled
its new INS401 high-performance
inertial navigation
system with an RTK-enabled
dual frequency GNSS receiver.
The unit promises precise
autonomous vehicle positioning
through technologies like
triple-redundant inertial sensors
and a positioning engine.
It is designed for use in
SAE Level 2 and higher ADAS
and other high-volume applications requiring precise position
information. It provides cm-level accuracy with enhanced
reliability and performance during GNSS outages.
The dead-reckoning solution also delivers strong performance
in GNSS-challenged urban environments such as areas
with tall buildings or underground structures. The company
also states that the INS401 system is significantly more
cost-effective to produce than comparable systems with a
unit price of less than $500.
For more information, visit http://info.hotims.com/82329-402
APPLICATIONS
ADHESIVES for
SENSOR
Select compounds offer:
NXP Semiconductors (Eindhoven, Netherlands) has made
an update to its imaging radar processor. The update includes
4D imaging radar sensing with up to six front and
rear radar sensors in a 360-degree radius. This update ensures
the imaging radar can simultaneously measure velocity
and classify objects at distances of up to 300 m
(985 ft) while distinguishing between fast-moving targets
and slower or static obstacles. NXP states that its 4D imaging
radar is the first to deliver concurrent 3-in-1 multimode
sensing across short-, mid- and long-range operation.
This enables simultaneous sensing through a wider
field of view around the vehicle.
For more information, visit http://info.hotims.com/82329-401
AUTOMOTIVE ENGINEERING
THERMAL CONDUCTIVITY
Up to 6.5 W/( m*K)
ELECTRICAL INSULATION
Volume resistivity >1014
14
ohm-cm
ELECTRICAL CONDUCTIVITY
Volume resistivity <0.001 ohm-cm
SENSOR
APPLICATIONS
EPOXIES & SILICONES
EPOXIES & SILICONES
Hackensack, NJ 07601 USA ∙ +1.201.343.8983 ∙ main@masterbond.com
www.masterbond.com
Free Info at http://info.hotims.com/82329-710
23
http://info.hotims.com/82329-402 http://info.hotims.com/82329-400 http://info.hotims.com/82329-710 http://info.hotims.com/82329-401
Automotive Engineering - February 2022

Table of Contents for the Digital Edition of Automotive Engineering - February 2022
