Autonomous Vehicle Engineering - April 2022 - 26

New Tools & Technologies
Micro Lens Arrays
Automotive Ethernet
Rohde & Schwarz (Munich, Germany) has partnered
with Realtek (Leimen, Germany) to ensure
compliance with current and future OPEN Alliance
standards via RTL9010 (1000BASE-T1 PHY)
chipset, which supports the OA TC10 Wake-up/
Sleep. The RTL9010 is an AEC-Q100 Grade 1
chipset with power consumption as low as
400mW. It also supports 12V/24V VBAT power
supply. The companies have jointly invested resources
into the development of products that meet the TC1 and TC12 standards set
by the OPEN Alliance. Furthermore, they are also actively investing in the TC15
(MultiGBASE-T1) market, the standards for automotive Ethernet.
For more information, visit http://info.hotims.com/82339-401
BrightView Technologies (Research
Triangle Park, North Carolina) has announced
the launch of its new T-Series
Top Hat Micro Lens Array (MLA) products
to create optical profiles for lidar,
3D sensing and display applications.
BrightView's T-Series of Top Hat MLA
products range from small to large angles
with rectangular and circular profiles.
They are specifically designed to
meet the requirements of vertical cavity
surface emitting laser (VCSEL), edge
emitting laser (EEL), and LED applications,
including high-efficiency, compatibility
with high peak laser power,
and optical uniformity. The T-Series Top
Hat MLA products are available in a
variety of substrate thicknesses and
material options including polycarbonate,
PET and glass.
For more information,
visit http://info.hotims.com/82339-400
Development Platform
Opal Kelly (Portland, Oregon) has released
the XEM8320-AU25P development platform
for the Xilinx Artix UltraScale+ FPGA. The new
platform features Opal Kelly's FrontPanel SDK
for building high-performance, software-connected
FPGA applications. The XEM8320AU25P
also leverages SYZYGY modular connectivity
for rapid prototyping and expansion as well as Artix UltraScale+
XCAU25P-2FFVB676E FPGA and USB 3.0 Type-C SuperSpeed interface. The platform
also includes 11 high-speed gigabit transceiver lanes via Artix UltraScale+
transceivers. Artix UltraScale+ transceivers support serial standards such as 10 GbE,
JESD-204B, DisplayPort, PCI Express, SATA, HD-SDI, XAUI and Aurora.
For more information, visit http://info.hotims.com/82339-402
Semiconductors
Renesas Electronics Corporation (Tokyo, Japan) announced
the expansion of its collaboration with
Honda in the field of ADAS. Honda also selected the
R-Car and RH850 for use in the Honda SENSING 360
omnidirectional safety and driver assistance system.
The first automobile model equipped with Honda
SENSING 360 is scheduled for release in China in
2022. The Renesas R-Car automotive SoC processes
sensing data from cameras, millimeter-wave radar
and lidar, as well as data for 3-dimensional high-definition maps and the global navigation
satellite system (GNSS). The SoC also monitors the vehicle's position and the
road conditions and computes route plans in real time, according to the companies.
For more information, visit http://info.hotims.com/82339-403
26 April 2022
AUTONOMOUS VEHICLE ENGINEERING
http://info.hotims.com/82339-401 http://info.hotims.com/82339-402 http://info.hotims.com/82339-400 http://info.hotims.com/82339-403

Autonomous Vehicle Engineering - April 2022

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Autonomous Vehicle Engineering - April 2022 - CVR4
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