Aerospace & Defense Technology - February 2021 - 12

Dispensable Gels

vs Gap Filler Pads

An Analysis of Thermal Management Materials

A

s advances in electronic
products have required
higher power in smaller
packages, the challenges associated with thermal management
have become more intense. Two general
types of thermal interface materials -
gels (or dispensable gap fillers) and gap
filler pads - are commonly used by design engineers for displacing air voids
and ensuring proper heat transfer. Each
has distinct advantages depending on
the application.
Following is an analysis of key performance and manufacturability characteristics in both conventional gap
pads and new advances in dispensable
gel materials.

Heat Transfer Fundamentals
The objective of thermal management in electronics packaging is the efficient removal of heat from the semiconductor junction to the ambient

environment. Thermally conductive
materials are used to eliminate air gaps
or voids from adjoining rough or uneven mating surfaces. Because the thermal interface material has a greater
thermal conductivity than the air it replaces, the resistance across the joint
decreases, and the component junction
temperature will be reduced.
When evaluating thermal interface
materials, design engineers seek to identify high-performance products that
meet the thermal, design, manufacturing and cost challenges inherent in
each customized application. Several
material types have been developed in
response to the changing needs of the
electronics packaging market in applications such as telecommunications
equipment, consumer electronics, automotive electronics, LEDs/lighting,
power conversion, power semiconductors, desktop computers/laptops and
servers, handheld devices, memory

12

www.aerodefensetech.com

Cov

ToC

modules and vibration dampening. In
this analysis, we are focusing on pads
and liquid or gel-like materials.

Gap Filler Pads: The Basics
Thermally conductive gap filler pads
offer excellent thermal properties and
high conformability at low clamping
forces. Key features and benefits include:
* High conformability
* Ultra-low deflection force
* High-tack surface to reduce contact resistance
* Minimal component stress
* Reduced " hot spots " on printed circuit
board
* Thicker pads can improve vibration
dampening
* Can " blanket " multiple components

Gels: The basics
Next-generation gels are highly conformable, pre-cured (in most cases), sin-

Aerospace & Defense Technology, February 2021



http://www.aerodefensetech.com http://www.abpi.net/ntbpdfclicks/l.php?202102ADTNAV

Aerospace & Defense Technology - February 2021

Table of Contents for the Digital Edition of Aerospace & Defense Technology - February 2021

Aerospace & Defense Technology - February 2021 - Intro
Aerospace & Defense Technology - February 2021 - Sponsor
Aerospace & Defense Technology - February 2021 - Cov I
Aerospace & Defense Technology - February 2021 - Cov II
Aerospace & Defense Technology - February 2021 - 1
Aerospace & Defense Technology - February 2021 - 2
Aerospace & Defense Technology - February 2021 - 3
Aerospace & Defense Technology - February 2021 - 4
Aerospace & Defense Technology - February 2021 - 5
Aerospace & Defense Technology - February 2021 - 6
Aerospace & Defense Technology - February 2021 - 7
Aerospace & Defense Technology - February 2021 - 8
Aerospace & Defense Technology - February 2021 - 9
Aerospace & Defense Technology - February 2021 - 10
Aerospace & Defense Technology - February 2021 - 11
Aerospace & Defense Technology - February 2021 - 12
Aerospace & Defense Technology - February 2021 - 13
Aerospace & Defense Technology - February 2021 - 14
Aerospace & Defense Technology - February 2021 - 15
Aerospace & Defense Technology - February 2021 - 16
Aerospace & Defense Technology - February 2021 - 17
Aerospace & Defense Technology - February 2021 - 18
Aerospace & Defense Technology - February 2021 - 19
Aerospace & Defense Technology - February 2021 - 20
Aerospace & Defense Technology - February 2021 - 21
Aerospace & Defense Technology - February 2021 - 22
Aerospace & Defense Technology - February 2021 - 23
Aerospace & Defense Technology - February 2021 - 24
Aerospace & Defense Technology - February 2021 - 25
Aerospace & Defense Technology - February 2021 - 26
Aerospace & Defense Technology - February 2021 - 27
Aerospace & Defense Technology - February 2021 - 28
Aerospace & Defense Technology - February 2021 - 29
Aerospace & Defense Technology - February 2021 - 30
Aerospace & Defense Technology - February 2021 - 31
Aerospace & Defense Technology - February 2021 - 32
Aerospace & Defense Technology - February 2021 - 33
Aerospace & Defense Technology - February 2021 - 34
Aerospace & Defense Technology - February 2021 - 35
Aerospace & Defense Technology - February 2021 - 36
Aerospace & Defense Technology - February 2021 - 37
Aerospace & Defense Technology - February 2021 - 38
Aerospace & Defense Technology - February 2021 - 39
Aerospace & Defense Technology - February 2021 - 40
Aerospace & Defense Technology - February 2021 - 41
Aerospace & Defense Technology - February 2021 - 42
Aerospace & Defense Technology - February 2021 - 43
Aerospace & Defense Technology - February 2021 - 44
Aerospace & Defense Technology - February 2021 - 45
Aerospace & Defense Technology - February 2021 - 46
Aerospace & Defense Technology - February 2021 - 47
Aerospace & Defense Technology - February 2021 - 48
Aerospace & Defense Technology - February 2021 - Cov III
Aerospace & Defense Technology - February 2021 - Cov IV
https://www.nxtbook.com/smg/techbriefs/24ADT04
https://www.nxtbook.com/smg/techbriefs/24ADT02
https://www.nxtbook.com/smg/techbriefs/23ADT12
https://www.nxtbook.com/smg/techbriefs/23ADT10
https://www.nxtbook.com/smg/techbriefs/23ADT09
https://www.nxtbook.com/smg/techbriefs/23ADT08
https://www.nxtbook.com/smg/techbriefs/23ADT06
https://www.nxtbook.com/smg/techbriefs/23ADT05
https://www.nxtbook.com/smg/techbriefs/23ADT04
https://www.nxtbook.com/smg/techbriefs/23ADT02
https://www.nxtbook.com/smg/techbriefs/22ADT12
https://www.nxtbook.com/smg/techbriefs/22ADT10
https://www.nxtbook.com/smg/techbriefs/22ADT09
https://www.nxtbook.com/smg/techbriefs/22ADT08
https://www.nxtbook.com/smg/techbriefs/22ADT06
https://www.nxtbook.com/smg/techbriefs/22ADT05
https://www.nxtbook.com/smg/techbriefs/22ADT04
https://www.nxtbook.com/smg/techbriefs/22ADT02
https://www.nxtbook.com/smg/techbriefs/21ADT12
https://www.nxtbook.com/smg/techbriefs/21ADT10
https://www.nxtbook.com/smg/techbriefs/21ADT09
https://www.nxtbook.com/smg/techbriefs/21ADT08
https://www.nxtbook.com/smg/techbriefs/21ADT06
https://www.nxtbook.com/smg/techbriefs/21ADT05
https://www.nxtbook.com/smg/techbriefs/21ADT04
https://www.nxtbook.com/smg/techbriefs/21ADT02
https://www.nxtbookmedia.com