Tech Briefs Magazine - August 2021 - 55

PRODUCT SPOTLIGHT
FAST PULSE TEST SOLUTIONS
Epoxy
Epoxyset, Woonsocket, RI, offers EPOXICAST™ M25T epoxy
with very low ion concentration and an extractable chlorine ion
level below 10 ppm. It was designed for microelectronic applications
and features low cure shrinkage and glass transition temperature
of 168 °C with a coefficient of expansion of 17 ppm/°C. It
can be used from -55 to 200 °C, has water absorption of 0.02%, and is chemical-resistant.
For Free Info Visit http://info.hotims.com/79416-108
Reverse Engineering Software
FARO®, Lake Mary, FL, offers RevEng™ Software 2021 reverse
engineering Scan-to-CAD software with automatic surfacing capabilities
and reduced data capture time. It is suited for aftermarket design,
creation of replacement parts, new design iterations, or additive manufacturing.
Users can import point cloud or mesh files from any source and repair the mesh. An
Automatic NURBS Surfaces Creation Tool allows for creation of a network of curves and surface
patches with the click of a button.
For Free Info Visit http://info.hotims.com/79416-109
Panel PCs
Cincoze, New Taipei City, Taiwan, offers CRYSTAL sunlight-readable
panel PCs that combine an industrial touch display and an
industrial embedded computer module. The systems offer a choice
of Intel® Atom®, Pentium®, and Core™ i3/i5 CPUs; up to 64 GB of memory;
and 2 × 2.5 " HDD/SSD. Display options include 8 " to 21.5 " with projective capacitive touch display
and 1600-nits backlight.
For Free Info Visit http://info.hotims.com/79416-106
Solder-Mount Receptacles
The 3305-X open-bottom, low-profile solder-mount receptacles from
Mill-Max Mfg. Corp., Oyster Bay, NY, are designed to be soldered into
a .060 " minimum mounting hole. A thin retention shoulder enables
plugged-in components to sit nearly flush to the board surface. Three
length options of .105 " , .130 " , and .155 " are available with above-board
height of .010 " . They use a beryllium copper contact clip to make connections with mated
round leads of .025 " to .037 " in diameter as well as square and rectangular leads.
For Free Info Visit http://info.hotims.com/79416-111
Silicone Sheeting
Bellofram Silicones, Newell, WV, offers 36 × 36 " solid silicone
sheeting available in 30 to 80 durometer and thickness from 1/8 " to
1/2 " (in 1/16 " increments). The sheeting is suited for die-cut solid
silicone gaskets and other sealing applications. Specialized sheeting
is also available and can be made in virtually any color.
For Free Info Visit http://info.hotims.com/79416-112
Field-Programmable Gate Arrays
Lattice Semiconductor Corp., Hillsboro, OR, introduced Lattice
CertusPro™-NX field-programmable gate arrays (FPGAs) that support
LPDDR4 external memory and up to eight programmable SERDES lanes
capable of speeds up to 10.3 Gbps. They enable communication and display
interfaces like 10 Gigabit Eth ernet, PCI Express, SLVS-EC,
CoaXPress, and DisplayPort. The FPGAs provide support for up to 100k logic cells.
For Free Info Visit http://info.hotims.com/79416-119
Terminal Blocks
WAGO, Germantown, WI, offers TOPJOB® S Mini terminal blocks that
feature Push-in CAGE CLAMP® connection technology. They are available
with open tool slot or orange pushbuttons that can be actuated with any
standard tool. The blocks can be mounted in miniature rail, snap-in mounting
foot for chassis mount, or direct mount with fixing flange.
For Free Info Visit http://info.hotims.com/79416-118
Tech Briefs, August 2021
Cov
www.techbriefs.com
ToC
Avtech offers over 500 standard models of high-speed
pulse generators for R&D and automated factoryfloor
testing. Some of our standard models include:
AVR-EB4-B: for reverse-recovery time tests
AV-156F-B: for airbag tests
AVO-9A-B: for laser diode tests
AV-151J-B: for piezoelectric tests
AVOZ-D2-B: for testing of attenuators
AVR-DV1-B: for phototriac dV/dt tests
Pricing, manuals, datasheets:
http://www.avtechpulse.com/
Avtech Electrosystems Ltd.
Free Info at http://info.hotims.com/79416-747
MULTIPHYSICS
MODELING AND
SIMULATION
APPLICATIONS
COMSOL Multiphysics® is a software
environment for creating
physics-based models and simulation
applications. Add-on products provide tools for
electromagnetics, structural, acoustics, fluid flow, heat
transfer, and chemical simulations. Interfacing products
offer a unified workflow with all major technical
computing and CAD tools. COMSOL Compiler™ and
COMSOL Server™ are used for deploying simulation
applications to colleagues and customers.
https://www.comsol.com/products
COMSOL, Inc.
Free Info at http://info.hotims.com/79416-748
DIE ATTACH
EPOXY WITH
HIGH TG
Master Bond EP17HTSDA
is a one part, no
mix, die attach epoxy
with electrical conductivity and high temperature
resistance. This specially formulated, silver filled
system features a high Tg of 140-150°C that is
maintained throughout its use. It passes MIL-STD883J
thermal stability requirements at 200°C.
https://www.masterbond.com/tds/ep17hts-da
Master Bond
Free Info at http://info.hotims.com/79416-749
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Tech Briefs Magazine - August 2021

Table of Contents for the Digital Edition of Tech Briefs Magazine - August 2021

Tech Briefs Magazine - August 2021 - Intro
Tech Briefs Magazine - August 2021 - Sponsor
Tech Briefs Magazine - August 2021 - Cov1
Tech Briefs Magazine - August 2021 - Cov2
Tech Briefs Magazine - August 2021 - 1
Tech Briefs Magazine - August 2021 - 2
Tech Briefs Magazine - August 2021 - 3
Tech Briefs Magazine - August 2021 - 4
Tech Briefs Magazine - August 2021 - 5
Tech Briefs Magazine - August 2021 - 6
Tech Briefs Magazine - August 2021 - 7
Tech Briefs Magazine - August 2021 - 8
Tech Briefs Magazine - August 2021 - 9
Tech Briefs Magazine - August 2021 - 10
Tech Briefs Magazine - August 2021 - 11
Tech Briefs Magazine - August 2021 - 12
Tech Briefs Magazine - August 2021 - 13
Tech Briefs Magazine - August 2021 - 14
Tech Briefs Magazine - August 2021 - 15
Tech Briefs Magazine - August 2021 - 16
Tech Briefs Magazine - August 2021 - 17
Tech Briefs Magazine - August 2021 - 18
Tech Briefs Magazine - August 2021 - 19
Tech Briefs Magazine - August 2021 - 20
Tech Briefs Magazine - August 2021 - 21
Tech Briefs Magazine - August 2021 - 22
Tech Briefs Magazine - August 2021 - 23
Tech Briefs Magazine - August 2021 - 24
Tech Briefs Magazine - August 2021 - 25
Tech Briefs Magazine - August 2021 - 26
Tech Briefs Magazine - August 2021 - 27
Tech Briefs Magazine - August 2021 - 28
Tech Briefs Magazine - August 2021 - 29
Tech Briefs Magazine - August 2021 - 30
Tech Briefs Magazine - August 2021 - 31
Tech Briefs Magazine - August 2021 - 32
Tech Briefs Magazine - August 2021 - 33
Tech Briefs Magazine - August 2021 - 34
Tech Briefs Magazine - August 2021 - 35
Tech Briefs Magazine - August 2021 - 36
Tech Briefs Magazine - August 2021 - 37
Tech Briefs Magazine - August 2021 - 38
Tech Briefs Magazine - August 2021 - 39
Tech Briefs Magazine - August 2021 - 40
Tech Briefs Magazine - August 2021 - 41
Tech Briefs Magazine - August 2021 - 42
Tech Briefs Magazine - August 2021 - 43
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Tech Briefs Magazine - August 2021 - 45
Tech Briefs Magazine - August 2021 - 46
Tech Briefs Magazine - August 2021 - 47
Tech Briefs Magazine - August 2021 - 48
Tech Briefs Magazine - August 2021 - 49
Tech Briefs Magazine - August 2021 - 50
Tech Briefs Magazine - August 2021 - 51
Tech Briefs Magazine - August 2021 - 52
Tech Briefs Magazine - August 2021 - 53
Tech Briefs Magazine - August 2021 - 54
Tech Briefs Magazine - August 2021 - 55
Tech Briefs Magazine - August 2021 - 56
Tech Briefs Magazine - August 2021 - 57
Tech Briefs Magazine - August 2021 - 58
Tech Briefs Magazine - August 2021 - 59
Tech Briefs Magazine - August 2021 - 60
Tech Briefs Magazine - August 2021 - Cov3
Tech Briefs Magazine - August 2021 - Cov4
Tech Briefs Magazine - August 2021 - MD-Cov1
Tech Briefs Magazine - August 2021 - MD-Cov2
Tech Briefs Magazine - August 2021 - MD-1
Tech Briefs Magazine - August 2021 - MD-2
Tech Briefs Magazine - August 2021 - MD-3
Tech Briefs Magazine - August 2021 - MD-4
Tech Briefs Magazine - August 2021 - MD-5
Tech Briefs Magazine - August 2021 - MD-6
Tech Briefs Magazine - August 2021 - MD-7
Tech Briefs Magazine - August 2021 - MD-8
Tech Briefs Magazine - August 2021 - MD-9
Tech Briefs Magazine - August 2021 - MD-10
Tech Briefs Magazine - August 2021 - MD-11
Tech Briefs Magazine - August 2021 - MD-12
Tech Briefs Magazine - August 2021 - MD-13
Tech Briefs Magazine - August 2021 - MD-14
Tech Briefs Magazine - August 2021 - MD-15
Tech Briefs Magazine - August 2021 - MD-16
Tech Briefs Magazine - August 2021 - MD-17
Tech Briefs Magazine - August 2021 - MD-18
Tech Briefs Magazine - August 2021 - MD-19
Tech Briefs Magazine - August 2021 - MD-20
Tech Briefs Magazine - August 2021 - MD-21
Tech Briefs Magazine - August 2021 - MD-22
Tech Briefs Magazine - August 2021 - MD-23
Tech Briefs Magazine - August 2021 - MD-24
Tech Briefs Magazine - August 2021 - MD-25
Tech Briefs Magazine - August 2021 - MD-26
Tech Briefs Magazine - August 2021 - MD-27
Tech Briefs Magazine - August 2021 - MD-28
Tech Briefs Magazine - August 2021 - MD-29
Tech Briefs Magazine - August 2021 - MD-30
Tech Briefs Magazine - August 2021 - MD-31
Tech Briefs Magazine - August 2021 - MD-32
Tech Briefs Magazine - August 2021 - MD-33
Tech Briefs Magazine - August 2021 - MD-34
Tech Briefs Magazine - August 2021 - MD-35
Tech Briefs Magazine - August 2021 - MD-36
Tech Briefs Magazine - August 2021 - MD-37
Tech Briefs Magazine - August 2021 - MD-38
Tech Briefs Magazine - August 2021 - MD-39
Tech Briefs Magazine - August 2021 - MD-40
Tech Briefs Magazine - August 2021 - MD-Cov3
Tech Briefs Magazine - August 2021 - MD-Cov4
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