EETimes - Apollo - July 20, 2009 - 32

Teardown Apollo ULD module: flip chip, 45 years ago By Ed Keyes and Vu Ho ost of us think of flip chip as the packaging technology for milliongate, high-power microprocessors. Forty-five years ago, however, flip-chip technology helped the United States put a man on the moon. Semiconductor Insights’ analysis of the Apollo unit logic device (ULD) module reveals a remarkable piece 32 EE Times | Apollo | July 20, 2009 M of technology that, in its time, probably represented as much “rocket science” as the rocket into which it was designed. Figure 1 is an optical photo of the overall module. Astonishingly, in an era when dual-in-line packages ruled, this tiny device used a surface-mount, gull-wingstyle package. Figure1: Top view of the Apollo ULD package

EETimes - Apollo - July 20, 2009

Table of Contents for the Digital Edition of EETimes - Apollo - July 20, 2009

Apollo - July 20, 2009
Contents
Applying the Lessons of Apollo
Why Did We Go to the Moon?
In the Trenches: Profiles of the Engineers Who Made Apollo Go
Apollo Perspectives: Video Interview with Filmmaker David Sington
Virtual Teardown: Apollo Spacesuit
Virtual Teardown: The ‘Genesis’ Rock
Apollo Chip Teardown: Unit Logic Device
Ted Sorensen on Apollo
Soviet Space Firsts
Apollo Reader Forum
EETimes - Apollo - July 20, 2009 - Apollo - July 20, 2009
EETimes - Apollo - July 20, 2009 - Contents
EETimes - Apollo - July 20, 2009 - Applying the Lessons of Apollo
EETimes - Apollo - July 20, 2009 - 4
EETimes - Apollo - July 20, 2009 - Why Did We Go to the Moon?
EETimes - Apollo - July 20, 2009 - 6
EETimes - Apollo - July 20, 2009 - 7
EETimes - Apollo - July 20, 2009 - 8
EETimes - Apollo - July 20, 2009 - In the Trenches: Profiles of the Engineers Who Made Apollo Go
EETimes - Apollo - July 20, 2009 - 10
EETimes - Apollo - July 20, 2009 - 11
EETimes - Apollo - July 20, 2009 - 12
EETimes - Apollo - July 20, 2009 - 13
EETimes - Apollo - July 20, 2009 - 14
EETimes - Apollo - July 20, 2009 - 15
EETimes - Apollo - July 20, 2009 - 16
EETimes - Apollo - July 20, 2009 - 17
EETimes - Apollo - July 20, 2009 - 18
EETimes - Apollo - July 20, 2009 - 19
EETimes - Apollo - July 20, 2009 - 20
EETimes - Apollo - July 20, 2009 - 21
EETimes - Apollo - July 20, 2009 - 22
EETimes - Apollo - July 20, 2009 - Apollo Perspectives: Video Interview with Filmmaker David Sington
EETimes - Apollo - July 20, 2009 - 24
EETimes - Apollo - July 20, 2009 - Virtual Teardown: Apollo Spacesuit
EETimes - Apollo - July 20, 2009 - 26
EETimes - Apollo - July 20, 2009 - 27
EETimes - Apollo - July 20, 2009 - 28
EETimes - Apollo - July 20, 2009 - Virtual Teardown: The ‘Genesis’ Rock
EETimes - Apollo - July 20, 2009 - 30
EETimes - Apollo - July 20, 2009 - 31
EETimes - Apollo - July 20, 2009 - Apollo Chip Teardown: Unit Logic Device
EETimes - Apollo - July 20, 2009 - 33
EETimes - Apollo - July 20, 2009 - 34
EETimes - Apollo - July 20, 2009 - 35
EETimes - Apollo - July 20, 2009 - Ted Sorensen on Apollo
EETimes - Apollo - July 20, 2009 - 37
EETimes - Apollo - July 20, 2009 - 38
EETimes - Apollo - July 20, 2009 - Soviet Space Firsts
EETimes - Apollo - July 20, 2009 - 40
EETimes - Apollo - July 20, 2009 - 41
EETimes - Apollo - July 20, 2009 - Apollo Reader Forum
EETimes - Apollo - July 20, 2009 - 43
EETimes - Apollo - July 20, 2009 - 44
EETimes - Apollo - July 20, 2009 - 45
EETimes - Apollo - July 20, 2009 - 46
https://www.nxtbook.com/nxtbooks/cmp/eetimes_apollo_20090720
https://www.nxtbookmedia.com