Evaluation Engineering - 28

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1. NIR and linescan lenses
Two additions to the vendor's
product offerings include new
near-infrared (NIR) precision
aspheric lenses (pictured) and
TECHSPEC LS Series line-scan
lenses. The NIR precision
aspheric lenses are designed and
optimized to eliminate spherical
aberration. They are polished
through a computer-numericalcontrolled (CNC) process for high
performance across the NIR
spectrum. NIR precision aspheric
lenses are also available with
low numerical aperture designs
to maintain beam shape or with
high numerical aperture designs
for applications that require lightgathering. The new TECHSPEC
LS Series line-scan lenses are
suitable for applications such as
electronics and semiconductor
wafer inspection.

2. EMC filters

3. AWGs

Two new MAF1608GAD-L noisesuppression filters, designed for
audio lines, have a footprint of
1.6 x 0.8 mm and an insertion
height of 0.6 mm. They offer
rated currents of 3.2 and 2.3
A, respectively, and low DC
resistances of typically just 0.021
and 0.045 Ω. Their impedance
at 900 MHz is 120 and 200
Ω, respectively. Their low DC
resistance and rated current of
more than 2 A make them suitable
for smart speakers and external
speakers for tablets that require
power levels of 2 W or higher
as well as for headphones and
microphones.

Six new arbitrary waveform
generators (AWGs) have joined
the M2p.65xx Series PCIe
cards. The new AWGs boost
the available output range
to generate waveforms with
amplitude swings up to ±12 V
into 1 MΩ or ±6 V into 50 Ω. To
achieve the higher output voltage
ranges, the cards have been fitted
with additional amplification and
larger cooling plates. This makes
the cards wider, so that they
occupy two PCIe slots, but they
are still just 168 mm in length
and can fit into almost any PC,
turning it into a flexible waveform
generator.

TDK Corp.

Spectrum Instrumentation

Edmund Optics
28

EVALUATION ENGINEERING FEBRUARY 2020

4. Dual n-channel
60-V MOSFET
A new common-drain dual
n-channel 60-V MOSFET in the
compact, thermally enhanced
PowerPAK 1212-8SCD package
can increase power density and
efficiency in battery-management
systems, plug-in and wireless
chargers, DC/DC converters, and
power supplies. The SiSF20DN
offers RS-S(ON) down to 10 mΩ
typical at 10 V in a 3-mm by 3-mm
footprint. The vendor reports
this value is 89% lower than for
its previous-generation devices.
The result is reduced voltage
drop across the power path
and minimized power loss. The
device uses an optimized package
construction with two monolithically
integrated TrenchFET Gen IV
n-channel MOSFETs in a commondrain configuration.

Vishay Intertechnology Inc.
http://www.rsleads.com/002ee-177 http://www.rsleads.com/002ee-178 http://www.rsleads.com/002ee-179 http://www.rsleads.com/002ee-176
Evaluation Engineering

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