Evaluation Engineering - 15

Aehr Test
Systems' FOX-CP
single-wafer test
and reliabilityverification
solution.

the FOX-XP and FOX-NP systems, which
are optimal when the test time is measured in hours or days and the full wafer
can be tested in a single touchdown."
Booher, TotalTemp Technologies: "Our
hybrid benchtop chamber allows customers to apply the thermal stress of
different temperatures at the same time
or the ability to transition quickly with
the combination of convection and conductive heat transfer. We also have a new
line of benchtop wide-range temperature
chambers."

Gorley, Tektroni x: " The
Keithley DAQ6510 6½-digit
data acquisition and logging multimeter system
can test up to 80 devices in one setup with a
single DAQ6510 mainframe. It can expand
up to a higher channel count if necessary,
using the TSP-Link
interface to connect
and control multiple
DAQ6510 mainframes.
A nd it c a n mon itor temperature over
the range of -200°C to
1,820°C with any of eight different thermocouple types, five different RTDs, or
three different thermistors."
Preen AC Power Corp.'s AFC Series power
source

Turner, E-A Elektro-Automatik USA:
"Power-supply burn-in test equipment
like E-A's latest generation of programmable sources and programmable loads
utilize SiC power semiconductors to
improve performance and efficiency.
This new line of equipment is capable of
30-kW power (sources and load) in a 4U
rack. Products in this series also include
bidirectional source and load capability
with regenerative output that returns
over 95% of the test power back to the
utility source."
Hsu, Preen AC Power Corp.: "Preen's AFC
Series power source is the AC power product between a variable transformer and
a programmable power source, which
is cost-effective with regulated and adjustable output. Our ADG Series is a DC
power source that is very suitable for
low-to-high power DC-product burn-in
or aging testing."

actively test and burn-in a >1000-V device at wafer-level burn-in where thousands of devices are tested in parallel.
Our systems are capable of testing and
burning-in thousands of photonic devices on wafers in parallel for minutes to
hours while controlling the device temperature within a few degrees Celsius."
Booher, Total Temp Technologies: "Our
solutions have been utilized with heavyduty clamping systems to improve thermal conductivity with thermal platforms
and to simulate closure of packages
that will be welded shut after testing.
TotalTemp products have also been used
for an advanced temperature-control algorithm (cascade temperature control) to
reduce ramp times."
Turner, E-A Elektro-Automatik USA:
"The ability of these 4U, 30-kW units to
be operated in parallel has enabled E-A to
configure load-testing facilities with over
2 MW of total power delivered to DUTs
while only actually consuming 100 kW."

E-A Elektro-Automatik USA's Model EA PSB
10000 4U AC supply.

Hsu, Preen AC Power Corp.: "Typical users
of Preen's burn-in test products include
appliance manufactures, electronic device manufactures, military equipment
manufacturers, grid-tie device manufacturers, or companies performing newenergy power-cycling test."

Applications
What applications have customers been
using these vendors' burn-in test solutions for?
Rogers, Aehr Test Systems: "Our technology enables customers to utilize
sub-30-V power and device control to

Gorley, Tektronix: "Along with longer life,
the use of solid-state switching lends itself to faster scanning across multiple
devices. While typical burn-in tests may
aim to sample signals every 30 to 60 seconds, solid-state switching can support
sampling on the order of milliseconds."

NOVEMBER 2019 EVALUATIONENGINEERING.COM

15


http://www.rsleads.com/911ee-180 http://www.rsleads.com/911ee-180 http://www.rsleads.com/911ee-177 http://www.rsleads.com/911ee-177 http://www.rsleads.com/911ee-177 http://www.rsleads.com/911ee-178 http://www.rsleads.com/911ee-178 http://www.rsleads.com/911ee-178 http://www.rsleads.com/911ee-179 http://www.rsleads.com/911ee-179 http://www.EVALUATIONENGINEERING.COM

Evaluation Engineering

Table of Contents for the Digital Edition of Evaluation Engineering

Editorial: Three-way race to the future
By the Numbers
Industry Report
Signal Generators: New technology demands make signal generators more integral to testing
Burn-In and Test: The importance of burn-in and test extends from semiconductors to military equipment
Automotive Test: Automation boosts analog and digital test of automotive ICs
Sensor-Based Test: The 3R's of analog position sensor-based mechanical measurements
Power Test: Recommendation of voltage line disturbance test
Featured Tech
Tech Focus
Semiconductors: Heterogeneous integration ramps up electronics clout
Evaluation Engineering - Cover1
Evaluation Engineering - Cover2
Evaluation Engineering - 1
Evaluation Engineering - By the Numbers
Evaluation Engineering - 3
Evaluation Engineering - Industry Report
Evaluation Engineering - 5
Evaluation Engineering - Signal Generators: New technology demands make signal generators more integral to testing
Evaluation Engineering - 7
Evaluation Engineering - 8
Evaluation Engineering - 9
Evaluation Engineering - 10
Evaluation Engineering - 11
Evaluation Engineering - 12
Evaluation Engineering - Burn-In and Test: The importance of burn-in and test extends from semiconductors to military equipment
Evaluation Engineering - 14
Evaluation Engineering - 15
Evaluation Engineering - Automotive Test: Automation boosts analog and digital test of automotive ICs
Evaluation Engineering - 17
Evaluation Engineering - 18
Evaluation Engineering - 19
Evaluation Engineering - 20
Evaluation Engineering - 21
Evaluation Engineering - Sensor-Based Test: The 3R's of analog position sensor-based mechanical measurements
Evaluation Engineering - 23
Evaluation Engineering - Power Test: Recommendation of voltage line disturbance test
Evaluation Engineering - 25
Evaluation Engineering - 26
Evaluation Engineering - 27
Evaluation Engineering - Featured Tech
Evaluation Engineering - 29
Evaluation Engineering - Tech Focus
Evaluation Engineering - 31
Evaluation Engineering - Semiconductors: Heterogeneous integration ramps up electronics clout
Evaluation Engineering - Cover3
Evaluation Engineering - Cover4
https://www.nxtbook.com/endeavor/evaluationengineering/novemberdecember2020
https://www.nxtbook.com/endeavor/evaluationengineering/Evaluation_Engineering_October_2020
https://www.nxtbook.com/endeavor/evaluationengineering/september2020
https://www.nxtbook.com/endeavor/evaluationengineering/August_2020
https://www.nxtbook.com/endeavor/evaluationengineering/july2020
https://www.nxtbook.com/endeavor/evaluationengineering/mayjune2020
https://www.nxtbook.com/endeavor/evaluationengineering/april2020
https://www.nxtbook.com/endeavor/evaluationengineering/march2020
https://www.nxtbook.com/endeavor/evaluationengineering/february2020
https://www.nxtbook.com/endeavor/evaluationengineering/january2020
https://www.nxtbook.com/endeavor/evaluationengineering/december2019
https://www.nxtbook.com/endeavor/evaluationengineering/november2019
https://www.nxtbook.com/endeavor/evaluationengineering/october2019
https://www.nxtbook.com/endeavor/evaluationengineering/september2019
https://www.nxtbook.com/endeavor/evaluationengineering/august2019
https://www.nxtbook.com/endeavor/evaluationengineering/july2019
https://www.nxtbook.com/endeavor/evaluationengineering/june2019
https://www.nxtbook.com/endeavor/evaluationengineering/may2019
https://www.nxtbook.com/endeavor/evaluationengineering/april2019
https://www.nxtbook.com/endeavor/evaluationengineering/march2019
https://www.nxtbook.com/endeavor/evaluationengineering/february2019
https://www.nxtbookmedia.com