Potentials - July/August 2016 - 17
(a)
and others necessitate alternate
manufacturing methods including
deterministic robotic pick and place
and stochastic self-assembly. In addition, transfer-printing-based microassembly, i.e., micro-LEGO, would
be the third axis to complement
monolithic microfabrication due its
potential for assembly scalability
and flexibility.
(b)
Read more about it
* V. Sariola, Q. Zhou and H. N.
(c)
(d)
Fig3 exemplary microstructures and a microdevice fabricated by LeGo-like microassembly. micro-teapot, (b) a micro-pagoda, (c) a micro-mirror device, and (d) micromotor structures. all are made of silicon (gray) and conductive (purple) or nonconductive
(green) elastomers. Scale bars are 100 μm. (reproduced with permission from h. keum,
et al., 2012; j.D. eisenhaure, et al., 2016; and Z. Yang, et al., 2015.)
architectures of assembled structures and devices are extre mely
challenging, if not impossible, to
reproduce via conventional monolithic microfabrication or other microassembly techniques, such as
those based on robotic pick and
place and self-assembly.
question of transfer printing is how
to achieve process parallelism and
selectivity simultaneously.
In addition, quick and selective
material joining processes must
also be developed to enable scalable
and flexible microassembly. The use
of reversible dry adhesion of respon-
While miniaturized electronic device manufacturing
has and will continue to rely on monolithic
microfabrication, further advances to enable 3-D
integration of active and passive components,
3-D architectures for MEMS, and others
necessitate alternate manufacturing methods.
Future of micro-lEGo
Transfer printing natively supports
mass production since it involves
an elastomeric surface that may
deliver micro-objects in parallel or
roll-to-roll fashions, yet microLEGO based on transfer printing
has yet to be demonstrated with
any significant degree of parallelism. Furthermore, for the improvement of process flexibility selective
manipulation of micro-objects is
desired. In this regard, the grand
sive materials, such as shape memory polymers, in place of elastomers,
and local thermal annealing techniques including laser raster scanning are being actively researched to
meet these needs.
While miniaturized electronic
device manufacturing has continued and will continue to rely on
monolithic microfabrication, further advances to enable 3-D integration of active and passive components, 3-D architectures for MEMS,
Koivo, "Hybrid microhandling: A
unified view of robotic handling and
self-assembly," J. Micro-Nano Mechatronics, vol. 4, nos. 1-2, pp. 5-16,
2008.
* S. Kim, J. Wu, A. Carlson, S. H.
Jin, A. Kovalsky, P. Glass, Z. Liu, N.
Ahmed, S. L. Elgan, W. Chen, P. M.
Ferreira, M. Sitti, Y. Huang, and J. A.
Rogers, "Microstructured elastomeric
surfaces with reversible adhesion
and examples of their use in deterministic assembly by transfer printing," Proc. Natl. Acad. Sci, vol. 107,
no. 40, pp. 17,095-17,100, 2010.
* H. Keum, A. Carlson, H. Ning, A.
Mihi, J. D. Eisenhaure, P. V. Braun,
J.A. Rogers, and S. Kim, "Silicon
micro-masonry using elastomeric
stamps for three-dimensional microfabrication," J. Micromechanics Microeng., vol. 22, no. 5, p. 055018, 2012.
* J. D. Eisenhaure, S. I. Rhee, A.
M. Al-Okaily, A. Carlson, P. M. Ferreira, and S. Kim, "The use of shape
memory polymers for MEMS assembly," J. Microelectromech. Syst., vol.
25, no. 1, pp. 69-77, 2016.
* Z. Yang, B. Jeong, and A. Vakakis, and S. Kim, "A tip-tilt-piston
micromirror with an elastomeric
universal joint fabricated via micromasonry," J. Microelectromech. Syst.,
vol. 24, no. 2, pp. 262-264, 2015.
about the author
Seok Kim (skm@illinois.edu) is an
assistant professor at the University
of Illinois at Urbana-Champaign.
His current research interests include biomimetic-engineered surfaces for reversible dry adhesion and
tunable wetting, transfer printingbased microassembly, and 3-D MEMS
fabrication technologies.
IEEE PotEntIals
Jul y/August 201 6
■
17
Table of Contents for the Digital Edition of Potentials - July/August 2016
Potentials - July/August 2016 - Cover1
Potentials - July/August 2016 - Cover2
Potentials - July/August 2016 - 1
Potentials - July/August 2016 - 2
Potentials - July/August 2016 - 3
Potentials - July/August 2016 - 4
Potentials - July/August 2016 - 5
Potentials - July/August 2016 - 6
Potentials - July/August 2016 - 7
Potentials - July/August 2016 - 8
Potentials - July/August 2016 - 9
Potentials - July/August 2016 - 10
Potentials - July/August 2016 - 11
Potentials - July/August 2016 - 12
Potentials - July/August 2016 - 13
Potentials - July/August 2016 - 14
Potentials - July/August 2016 - 15
Potentials - July/August 2016 - 16
Potentials - July/August 2016 - 17
Potentials - July/August 2016 - 18
Potentials - July/August 2016 - 19
Potentials - July/August 2016 - 20
Potentials - July/August 2016 - 21
Potentials - July/August 2016 - 22
Potentials - July/August 2016 - 23
Potentials - July/August 2016 - 24
Potentials - July/August 2016 - 25
Potentials - July/August 2016 - 26
Potentials - July/August 2016 - 27
Potentials - July/August 2016 - 28
Potentials - July/August 2016 - 29
Potentials - July/August 2016 - 30
Potentials - July/August 2016 - 31
Potentials - July/August 2016 - 32
Potentials - July/August 2016 - 33
Potentials - July/August 2016 - 34
Potentials - July/August 2016 - 35
Potentials - July/August 2016 - 36
Potentials - July/August 2016 - 37
Potentials - July/August 2016 - 38
Potentials - July/August 2016 - 39
Potentials - July/August 2016 - 40
Potentials - July/August 2016 - 41
Potentials - July/August 2016 - 42
Potentials - July/August 2016 - 43
Potentials - July/August 2016 - 44
Potentials - July/August 2016 - 45
Potentials - July/August 2016 - 46
Potentials - July/August 2016 - 47
Potentials - July/August 2016 - 48
Potentials - July/August 2016 - Cover3
Potentials - July/August 2016 - Cover4
https://www.nxtbook.com/nxtbooks/ieee/potentials_20190102
https://www.nxtbook.com/nxtbooks/ieee/potentials_20181112
https://www.nxtbook.com/nxtbooks/ieee/potentials_20180910
https://www.nxtbook.com/nxtbooks/ieee/potentials_20180708
https://www.nxtbook.com/nxtbooks/ieee/potentials_20180506
https://www.nxtbook.com/nxtbooks/ieee/potentials_20180304
https://www.nxtbook.com/nxtbooks/ieee/potentials_20180102
https://www.nxtbook.com/nxtbooks/ieee/potentials_111217
https://www.nxtbook.com/nxtbooks/ieee/potentials_091017
https://www.nxtbook.com/nxtbooks/ieee/potentials_070817
https://www.nxtbook.com/nxtbooks/ieee/potentials_050617
https://www.nxtbook.com/nxtbooks/ieee/potentials_030417
https://www.nxtbook.com/nxtbooks/ieee/potentials_010217
https://www.nxtbook.com/nxtbooks/ieee/potentials_111216
https://www.nxtbook.com/nxtbooks/ieee/potentials_091016
https://www.nxtbook.com/nxtbooks/ieee/potentials_070816
https://www.nxtbook.com/nxtbooks/ieee/potentials_050616
https://www.nxtbook.com/nxtbooks/ieee/potentials_030416
https://www.nxtbook.com/nxtbooks/ieee/potentials_010216
https://www.nxtbook.com/nxtbooks/ieee/potentials_111215
https://www.nxtbook.com/nxtbooks/ieee/potentials_091015
https://www.nxtbook.com/nxtbooks/ieee/potentials_070815
https://www.nxtbook.com/nxtbooks/ieee/potentials_050615
https://www.nxtbook.com/nxtbooks/ieee/potentials_030415
https://www.nxtbook.com/nxtbooks/ieee/potentials_010215
https://www.nxtbook.com/nxtbooks/ieee/potentials_111214
https://www.nxtbook.com/nxtbooks/ieee/potentials_091014
https://www.nxtbook.com/nxtbooks/ieee/potentials_070814
https://www.nxtbookmedia.com