Electronics Protection - Fall 2015 - (Page 30)
Global Data Center Cooling Market is Expected
To Reach $11.65 Billion, by 2020
According to a new report by Allied Market Research titled,
"Global Data Center Cooling Market - Size, Share, Global Trend,
Company Profiles, Demand, Insights, Analysis, Research, Report,
Opportunities, Segmentation, and Forecast 2014 - 2020", the global data center cooling market is expected to reach $11.65 billion
by 2020, registering a CAGR of 13.17 percent during 2014-2020.
Precision Air Conditioning (PAC) would drive the market significantly by the year 2020, as its setup cost is comparatively less
than Precision Air Handling Unit (PAHU). The data center cooling
system market primarily includes two components chillers and air
conditioners. Chillers contributed to 70 percent of total global
data centre cooling market in 2013.
Amongst all verticals, telecom and IT, are the major contributors to the market revenue of the data center cooling market. The
growing number of applications in healthcare and retail sector
have a good scope in the data center cooling solutions. A large
amount of data processing is required due to the rapid increase in
e-commerce sites and growth in hospital data. Banking, financial
services and insurance (BFSI), energy and others sector will prove
as a moderate contributor, in terms of revenue, for the global data
centre cooling market. The cooling technology giant, Emerson,
launched an extended-size version of the ultra-silent outdoor
coil condenser for data centre cooling systems which features an
increased capacity of 220 KW.
Increase in data volume and cloud adoption are the major
market drivers for the growth of this market. The North American
region will prove to be a major revenue contributor in the data
center cooling market during the forecast period. However, with
the rise in industrialization, the Asia-Pacific market would also be a
key region in the cooling market.
The growth of the data center cooling market is supplemented
by big data processing which requires more cooling solutions.
Companies like Emerson, Schneider and Rittal are enhancing their
cooling capacity to reduce extra power consumption. In order
to gain higher market share, companies are adopting product
launches along with acquisition and partnership as prime strategies. Prominent companies profiled in the report include Emerson,
Schneider, Rittal, Stulz, IBM, HP, AdavtiveCOOL and Hitachi.
Status of Flexible Encapsulation to Enable
In 2020 flexible barrier manufacturing for flexible electronic
devices such as displays will be a market worth more than US$184
million according to IDTechEx Research. That equates to 3.8 million square meters of flexible barrier films for electronics.
Although multilayer approaches (usually organic and inorganic
layers) have been the most popular solution for flexible encapsulation so far, there is significant development work with solutions
based on single layer approaches such as flexible glass or atomic
layer deposition (ALD) which could, in later years, capture part of
the market. The table below, compiled by IDTechEx analysts shows
some of the characteristics of flexible glass and ALD films as developers are looking to bring them to market.
Flexible glass is a significant technical achievement yet IDTechEx
Research believes that it will not be the solution of choice for
encapsulation of flexible electronics in the short to medium term,
for multiple reasons. In spite of the marketing spin given by the
manufacturers, glass is inherently a fragile material and requires
specialized handling and processing. While plastic materials can
also be damaged, there is an important difference between the
two: damage of barriers on plastic can lead to the failure of a
Fall 2015 * www.ElectronicsProtectionMagazine.com
specific part, however, shattering of glass, even if protective sheets
are used, leads to particle contamination on the defect line able
to affect multiple parts.
Inherent fragility of flexible glass makes sheet edges critical. All
suppliers propose protective tabs to reduce the problem. However, any other particle on the processing equipment could also
become a focal point of stress and lead to shattering of the glass
sheet or web.
A strong point of traditional glass encapsulation (especially for
top emission devices) has been its ability to form truly hermetic
packaging by using glass frit and laser sealing. This advantage may
not be transferable to flexible glass where glass-to-glass sealing
may be very problematic and difficult because points of stress and
relative twisting of the two sheets must be avoided in the laser
firing of the frit. It may be that flexible glass has to be used in
combination with adhesives (and desiccants).
Flexibility is another issue. Although glass is very flexible if flexed
along a well-defined axis, it can be poor at tolerating any stress out
of axis, so much so that twisting the sheet may lead to fracture.
This is true with or without protective film applied to the glass. Extreme flexibility (r< 2-3 mm) may also be a problem. Data that has
been shown would put the flexibility limit around r= 2.5 cm. Consequently, flexible glass as an encapsulant superstrate or substrate
may be good for conformal applications, but for truly flexible applications there seem to be several challenges to be overcome.
The thermal stability of flexible glass makes it the best choice
as substrate for back-planes of high-resolution high-end large displays. Glass enables improved resolution and good registration between layers during processing compared to plastic substrates like
PET, PEN, and PI. However, IDTechEx analysts and other affiliate
experts have only seen results with metal oxide backplanes only
so far (Tprocess < 350°C), none with LTPS backplanes (Tprocess
< 450°C). If processability up to 450°C is indeed possible, flexible glass would be a very good choice as a substrate for flexible
AMOLED TV. Those devices are bottom emission (BE) AMOLED,
normally have a metal foil as back encapsulant, a higher cost
tolerance. Regarding R2R processing of flexible glass, it has demonstrated possible. Manufacturing by R2R will require specialized
tools not differently than fabrication of barrier in R2R.
The multi-layer approach if correctly implemented on dedicated tools may have the potential to be low cost but an open question remains as to how low the defect density of barrier on foil
can be. Consequently, it is an open question what the maximum
size of displays that can be encapsulated with compatible yield can
be. As it transpires from the discussion above, plastic engineered
superstrate (=encapsulant foil) may be better for smaller devices
(wearable, phone, tablets), while flexible glass may be better for
TVs and in general larger displays.
Additionally, the smoothness of plastic films, even with smoothing layers, is not as good as glass (0.2 nm). This may be a problem
for organic TFT backplanes. Finally optical transmission below
400nm require glass as substrate since PET and PEN have a cut
off around 400 nm (PEN). IDTechEx does not see this as a critical
limitation for general display applications (it may be for OPV).
ALD is another flexible encapsulation technology receiving a
lot of attention with several players currently developing solutions
based on it. It seems like it is not a short-term solution, if it will
ever be one as a stand-alone layer but ALD may be a solution in a
multi-layer stack in combination with a sputtered or PECVD layer
if it would be possible to find a good cost structure. Regarding
the intrinsic properties of the material, ALD film deposited at low
temperature (T<80 C) have a superior quality when tested at room
temperature. A single ALD layer less-than 50 nm thick can perform
Table of Contents for the Digital Edition of Electronics Protection - Fall 2015
Electronics Protection - Fall 2015
Beat the Heat: Six Best Practices for Protecting Your People and Your Business from Arc Flash Hazards
Data Center Design and Cooling for Sensitive Electronics
Electronic Access Solutions - Design Considerations for Your Data Center
An Unsung Hero: the Gas Discharge Tube
Innovation Demands That You Break the Rules
Calendar of Events
Electronics Protection - Fall 2015