EPN May 2012 - (Page 49)

rf&wireless Wireless Power Transmitter-Receiver single chip transfers charge in reduced footprint Second-Gen Power Amplifiers 4G LTE and WCDA models “best peak efficiency” ireless charging can be incorporated into more places and locations if the footprint is small enough to allow innovative placements. IDT believes that its IDT9030 is the world’s first, single-chip, wireless power transmitter which additionally reduces the conventional footprint by 80%. The company also introduces the IDT9020 single chip receiver, claimed to be the highest power single chip receiver to date. The complementary multimode receiver outputs twice the power of commonly used solutions, cutting charging time in half, says the company. The two devices are designed to meet the Wireless Power Consortium Qi (pronounced “chee”) standard. Both transmitter and receiver can support proprietary features as well as Qi, using the built-in protocol detection, allowing engineers to add features, to improve security or to increase power output. The transmitter reduces application footprint from 1800 to 360mm2 and reduces the component count from nine ICs to one. Charging stations can therefore be deployed virtually anywhere, says the company, from homes, offices, libraries, stores, public waiting areas, to airports, and airplane seats. At the moment, use in automotives is restricted as the mobile nature of the interior challenges the alignment of the devices’ coils; the charge is transferred through inductive coupling. (The company is working with car manufacturers as the mobile nature of the car’s interior means that the coils in the transmitter and receiver have to be magnetically guided to be aligned for effective use.) In Qi mode, the receiver delivers up to 5W and when used with the transmitter in a proprietary configuration, it can deliver up to 7.5W, exceeding the requirements for powerful mobile devices, such as tablets, smart phones, digitals cameras, GPS units, and headsets. The two devices also feature proprietary multilayered foreign object detection using multi-parameter algorithms. The transmitter and receiver are sampling now and are available in 48-lead 6x6mm VFQFN and 56-lead 7x7 mm TQFN respectively. A 5x5mm wafer CSP receiver option will be available in Q2. iDT W S ix 4G LTE power amplifiers have been added to the RFMD portfolio. They are claimed to deliver the industry’s best peak efficiency and current consumption in LTE mode. They complement the company’s first-generation high efficiency power amplifiers for WCDMA. The portfolio now covers WCDMA bands 1, 2, 3, 4, 5, and 8, and LTE bands 4, 7, 11, 13, 17, 18, 20, and 21. The amplifiers will increase data throughput, battery life and thermal performance to meet the LTE broadband requirements for mobile devices. They deliver ultra-high peak efficiency of 42 to 44% in LTE mode and deliver what the company claims is unprecedented linearity at the highest power conditions, enabling bandwidths up to 20MHz, resulting in higher data transfer rates. The company believes that power management will become more significant this year, as average power tracking and envelope tracking schemes are introduced. RF MicRo Devices www.epn-online.com/search?search_keyword=47546 www.epn-online.com/search?search_keyword=47489 epn issue n ° 5 – May 2012 0 49 http://www.epn-online.com/search?search_keyword=47546 http://www.digikey.com/europe http://www.epn-online.com/search?search_keyword=47489

Table of Contents for the Digital Edition of EPN May 2012

Cover
RS Components
Contents
Editorial comment
Maxim
On the web
VICOR
New products
ROHM
Teseq
Digi-Key
Digi-Key
International Rectifier
Home networking
Taiyo Yuden
Fujitsu
Power management
Traco Electronics
Fischer
Virginia Panel Corp
International Rectifier
New products
Agilent
Micrel
Coilcraft
Digi-Key
Automotive electronic
Sunon
Test corner
Digi-Key
VDI
Power perspective
RF & Wireless
Digi-Key
Design application
40th anniversary interview
New products
Industrial Automation
Digi-Key
Distribution spotlight

EPN May 2012