IEEE Solid-States Circuits Magazine - Summer 2018 - 35
Samuel Palermo, Sebastian Hoyos, Shengchang Cai,
Shiva Kiran, and Yuanming Zhu
T
he ever-increasing
number of networked devices
and cloud computing applications has
created dramatic growth in data center
traffic. This necessitates that the serial
links that perform the communication
between ICs in these systems must operate at higher per-channel data rates,
with proposed Ethernet and Optical
Internetworking Forum standards supporting 56 Gb/s and scaling beyond
100 Gb/s in the future. However, the
large amount of frequency-dependent
loss present in conventional electrical
channels makes the use of common
two-level pulse amplitude modulation
(PAM-2) challenging without significant
infrastructure upgrades. This motivates
the use of the more spectrally efficient
four-level PAM (PAM-4). While PAM-4 has
a Nyquist frequency half of PAM-2, it is
more sensitive to residual intersymbol
interference (ISI). Thus, receiver front
ends often employ large tap-count feed-
forward equalizers (FFEs) that are difficult to robustly implement in the analog
domain due to process, voltage, and
temperature variations.
Figure 1 shows a serial link receiver
front end that employs an analog-todigital converter (ADC) followed by digital signal processing (DSP) to perform
ISI cancellation and symbol detection
in the digital domain. This ADC-based
receiver is well suited for more spectrally efficient modulation schemes,
such as PAM-4, and benefits from the
Analog-to-Digital
Converter-Based
Serial Links
An overview
Digital Object Identifier 10.1109/MSSC.2018.2844603
Date of publication: 13 August 2018
1943-0582/18©2018IEEE
IEEE SOLID-STATE CIRCUITS MAGAZINE
su m m E r 2 0 18
35
IEEE Solid-States Circuits Magazine - Summer 2018
Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Summer 2018
Contents
IEEE Solid-States Circuits Magazine - Summer 2018 - Cover1
IEEE Solid-States Circuits Magazine - Summer 2018 - Cover2
IEEE Solid-States Circuits Magazine - Summer 2018 - Contents
IEEE Solid-States Circuits Magazine - Summer 2018 - 2
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IEEE Solid-States Circuits Magazine - Summer 2018 - Cover3
IEEE Solid-States Circuits Magazine - Summer 2018 - Cover4
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