Electronics Protection - July/August 2013 - (Page 30)

Industry News Calendar of Events IMAPS 2013, September 29- Oct. 3rd, 2013 Orlando, Fla. www.imaps.org 2013 IEEE Symposium on EMC August 5-9, 2013, Denver, Co. www.emc2013.org EOS/ESD Symposium 2012, September 8-13, 2012, Las Vegas, Nev. www.esda.org IEEE ECEE 2013 September 15-19, 2013, Denver, CO. www.ecce2013.org SpecTECH Materials and Enclosure Educational Course Graduates Can Earn 16 PDH’s Engineers can now attend SpecTECH to meet state PDH requirements. SpecTECH is a nationally-recognized educational program developed specifically to provide a comprehensive understanding of material sciences as relates to the proper selection of enclosures for diverse applications ranging from electrical connections to protection of sensitive control and measurement systems. The two-day, hands-on educational class is accredited for 16 PDH’s. Additionally, SpecTECH is acrredited for 12 CEU’s through NABCEP (The North American Board of Certified Energy Practitioners). SpecTECH is interactive and focuses on real-life applications, case studies, processing tours, multimedia, lab work, materials demonstrations, learning-by-doing, and direct one-on-one time with professionals who are experts in enclosures and materials. Demand Set to Outstrip Supply in Latin American Co-Location Data Center Market Demand for co-location data center facilities in the Latin American region looks likely to outstrip supply according to new research released by DCD Intelligence. The report, ‘Latin American Co-location’ concludes that there is room in the market for new entrants, especially in cities outside of the major hubs. Most of the countries in Latin America are classed as emerging markets in terms of data center market growth and in common with other emerging markets such as those in Asia Pacific. Colocation is now seen as a viable option for businesses in terms of outsourcing their data center requirements. In fact, a larger percentage of data center white space is outsourced in the LatAm region than in many western countries. “What we see in the Latin American markets is that companies are far less reluctance to outsource data center requirements than has been the case at same stage of market development in other regions,” said Nicola Hayes, managing director, DCD Intelligence. “In previous years the co-location market was hampered in Latin America by a lack of suitable pure co-location space but this has changed over the past two years with a greater variety of stock now available.” 2012 saw a significant amount of new build plus expansion to existing facilities in many of the countries researched and whilst Brazil continues to offer the largest amount of co-location space and has the largest number of providers across the region, other countries are gaining momentum. For example, Colombia witnessed the highest number of new entrants to the market and Chile’s growth rate in terms of available space has overtaken that of Mexico. Although supply is increasing, there is still room for new entrants, particularly as demand is rising not only in the major cities 30 Design East, September 30-Oct. 3rd, 2013Boston, MA. http://east.ubmdesign.com OSP Expo, October 8-10, 2013 Dallas, Texas www.ospmag.com Remote Monitoring and Control 2013, Dec. 12-13, 2013 Las Vegas, Nev. www.RemoteExpo.com where the majority of space is located but also in secondary locations. The Latin American Co-location report also identified that providers with a regional rather than single country presence are for the most part international providers rather than native Latin American companies. Parker Aerospace Selected to Provide Thermal Management System for Joint Strike Missile Parker Aerospace was awarded a contract for the thermal management system for Kongsberg Defense Systems’ Joint Strike Missile (JSM). The JSM development is funded by the Norwegian government and planned to be the primary strike weapon for its upcoming deliveries of F-35 Joint Strike Fighters. Parker Aerospace will design and manufacture the missile’s complete thermal management solution, which includes pumping hardware, cold plates and fluid conveyance assemblies. The first set of system hardware will be delivered to Kongsberg during the first half of this year. “The JSM is a great product for our customers, and will capitalize on the successful Naval Strike Missile (NSM) already in service,” said Kongsberg Procurement Manager for JSM, Håkon Engebrethsen. “Parker Aerospace brings a wealth of thermal management experience and has a vital role in the development of this system for our latest generation missile.” MIT Technology Review Recognizes ABB Innovation Among Top 10 Technologies ABB has been recognized by “MIT Technology Review” for its hybrid high-voltage direct current (HVDC) breaker, placing it among the ten most important technology milestones of the past year. This is an annual list highlighting the top ten breakthrough technologies the editors believe will have the greatest impact on the shape of innovation in the years to come. “Since 2001, our editors have carefully selected the technologies poised to make the greatest impact on the shape of innovation in the years to come and the organizations leading the charge in those fields,” said MIT Technology Review’s editor in chief and publisher, Jason Pontin. “ABB is helping to define the way we think about creating practical, high-voltage direct current circuit breakers.” The hybrid HVDC breaker overcomes a 100-year-old barrier to the development of interconnected HVDC transmission grids, which can help improve grid reliability and enhance the capability of existing AC (alternating current) networks. It combines very fast mechanics with power electronics, and will be capable of ‘interrupting’ power flows equivalent to the output of a large power station within five milliseconds - that is thirty times faster than the blink of a human eye. July/August 2013 www.ElectronicsProtectionMagazine.com http://www.imaps.org http://www.emc2013.org http://east.ubmdesign.com http://www.esda.org http://www.ospmag.com http://www.ecce2013.org http://www.RemoteExpo.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - July/August 2013

Electronics Protection - July/August 2013
Newer Technology Releases Next-Generation Power2U AC/USB In Wall Charging Solution
Subzero Engineering Introduces PolarXpress DCiM SaaS Monitoring Solution
Specifiers of Enclosures for Components in Outdoor Applications: Be Aware of Material Selection Issues
Formable Phase Change Materials as Latent Heat Sinks for Portable Electronic Devices
How to Protect Electronic Circuits from Power Surges
Diamond Heat-Spreaders: Growth Methods and Applications
Standards-Based Design & Electronic Packaging Solutions
Reducing Room-Level Bypass Airflow Creates Opportunities to Improve Cooling Capacity and Operating Costs
Harnessing Laboratory Wind Tunnels
New DVR Enclosure with Prepackaged Thermoelectric Cooler
New Silver Conductive Aqueous Based Sodium Silicate System for EMI/RFI Shielding
Citizen and MechaTronix LED Cooling Cooperate On New Generation CitiLED COB’s
Eaton Expands 5P UPS Product Line to Provide Efficient Protection for Any IT Environment
Flex-Block System Puts Free-Standing Enclosures on New Footing
Gore Introduces Acoustic Vent for Protecting Electronic Devices
Industry News
Calendar of Events

Electronics Protection - July/August 2013