IEEE Awards Booklet - 2017 - 18

2017 ieee technical field awards

IEEE Biomedical Engineering Award

IEEE Cledo Brunetti Award

Sponsored by the IEEE Circuits and Systems Society and IEEE
Engineering in Medicine and Biology Society

Sponsored by the Brunetti Bequest

Bin He

Guido Groeseneken

For contributions to neuroengineering
and neuroimaging

For contributions to the characterization
and understanding of the reliability physics of advanced MOSFET nanodevices

The pioneering work of Bin He has transformed electroencephalography (EEG) from a one-dimensional detection modality to an
important noninvasive three-dimensional neuroimaging tool for
brain research and management of brain disorders. He developed
anatomically constrained brain source localization by introducing the boundary element method, which has significantly advanced the field of multimodal neuroimaging. He has changed
the understanding of what noninvasive brain-computer interfaces
(BCIs) can do. Using an array of electrode sensors placed over the
scalp, He developed novel BCI techniques to demonstrate that a
human can control the flight of a drone with their mind through
reading the EEG signals. He's neuroimaging innovations are playing an important role in the diagnosis and management of disorders including epilepsy, stroke, and Alzheimer's disease.
An IEEE Fellow, He is the Distinguished McKnight University
Professor of Biomedical Engineering and director of the Institute for Engineering in Medicine at the University of Minnesota,
Minneapolis, MN, USA.

Guido Groeseneken has been dedicated to tackling the most
critical reliability issues facing the continued scaling of semiconductors to help enable today's smaller, more powerful, and more
eﬃcient electronics. He developed the charge pumping technique, which quickly became a powerful method for the characterization of metal-oxide semiconductor field-eﬀect transistor
(MOSFET) devices. He used the technique to better understand
hot-carrier injection, which allowed the semiconductor industry
to optimize technologies to achieve longer lifetimes. He and his
team developed the percolation model to explain time-dependent
dielectric breakdown, identified transient charging eﬀects as a
limitation to the commercialization of high-k dielectrics, and
developed a measurement method to quantify these eﬀects. His
work has facilitated the development of very thin, high-k materials important to the further miniaturization of micro- and
nanoelectronic devices.
An IEEE Fellow, Groeseneken is a Research Fellow with IMEC
and professor with the KU Leuven, Belgium.

IEEE Components, Packaging, and Manufacturing Technology Award
Sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society

Paul S. Ho and King-Ning Tu

For contributions to the materials science of packaging and its impact on
reliability, specifically in the science of electromigration

The patented innovations of Paul S. Ho and King-Ning Tu
overcame the roadblocks caused by electromigration that limited high-performance chip reliability for the semiconductor and
electronics industry. First addressing the issues with aluminum
wiring, then copper, and eventually solder-bump connections,
their work provided the foundation to understanding the science of the failure mechanisms and guided high-performance
chip designs and manufacturing processes that enabled highvolume manufacturing of many silicon nodes with low cost

and high reliability. Ho and Tu also provided insights and solutions regarding the failure mechanisms associated with low-k
dielectric materials, tin whiskers, and electromigration in interconnects critical to the success of high-performance flip-chip
technologies.
An IEEE Fellow, Ho is director of the Laboratory for Interconnect and Packaging at the University of Texas at Austin, Austin,
TX, USA. Tu is the TSMC Chair Professor at National Chiao
Tung University, Hsinchu, Taiwan.

18 | 2017 IEEE awards bOOkLET

Table of Contents for the Digital Edition of IEEE Awards Booklet - 2017

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