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Shirong Lv (srlv@semi.ac.cn) is currently pursuing the Ph.D.
degree with the State Key Laboratory on Integrated Optoelectronics
Institute of Semiconductors, Chinese Academy of
Sciences, and also with the School of Materials Science and
Opto-Electronic Technology, University of Chinese Academy
of Sciences, Beijing, China. His research interests include VNA
calibration and on-wafer measurement. He received the B.S.
degrees in Electronics Science and Technology from the Hefei
University of Technology, Hefei, China in 2017.
Fusheng Tang (tangfusheng@huawei.com) is with Huawei
Technologies, Shenzhen, China. His research interests are high
speed optical device packaging. He received the Ph.D degree
from the University of Science and Technology of China, Hefei,
China in 2012.
Mingqi Jiao (jmq@semi.ac.cn) is currently pursuing the Ph.D.
degree with the State Key Laboratory on Integrated Optoelectronics
Institute of Semiconductors, Chinese Academy of
Sciences, and also with the School of Electronic, Electrical and
Communication Engineering, University of Chinese Academy
of Sciences, Beijing, China. His research interests include
microwave measurement and high-resolution spectrum measurement.
He received the B.S. degrees in materials science
and engineering from the Nanjing University of Aeronautics
and Astronautics, Nanjing, China in 2018.
Shengli Zhang (zhangshengli2@hisilicon.com) is with Huawei
Technologies, Shenzhen, China. His research interests involve
high speed optical device packaging. He received the Ph.D. degree
from the Institute of Semiconductors, Chinese Academy
of Sciences, Beijing, China in 2005.
LiangXie (xiel@semi.ac.cn) is a Professor with the State Key
Laboratory on Integrated Optoelectronics Institute of Semiconductors,
Chinese Academy of Sciences, Beijing, China. His
research focuses on the development of high-speed optoelectronic
devices and optical modules, optical communication
and optical fiber sensing technology. In recent years, he has
conducted research on modeling, simulation and testing of optoelectronic
devices and chips. He received the Ph.D. degree
from the University of Lanzhou University, Lanzhou, China
in 1998.
November 2022
IEEE Instrumentation & Measurement Magazine
37
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